DSPIC30F6012A Microchip Technology Inc., DSPIC30F6012A Datasheet - Page 220

• Manufacturer Part Number: DSPIC30F6012A
• Description: Dspic30f6011a/6012a/6013a/6014a High-performance Digital Signal Controllers
• Manufacturer: Microchip Technology Inc.

dsPIC30F6011A/6012A/6013A/6014A
80-Lead Plastic Thin Quad Flatpack (PT) 12x12x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS70143C-page 218
Note:
REF: Reference Dimension, usually without tolerance, for information purposes only.
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
JEDEC Equivalent: MS-026
Drawing No. C04-092
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
B
See ASME Y14.5M
See ASME Y14.5M
p
Dimension Limits
#leads=n1
E1
E
Units
CH
n1
A2
E1
D1
A1
n
p
L
F
E
D
B
A
c
n
MIN
.037
.002
.018
.004
.007
.025
.039
Preliminary
2
1
D1
0°
5°
5°
CH x 45°
.039 REF.
L
.020 BSC
.551 BSC
.551 BSC
.472 BSC
.472 BSC
INCHES
D
NOM
.004
.024
.043
.039
.006
.009
.035
A1
3.5°
10°
10°
80
20
A
MAX
.047
.006
.030
.008
.045
.041
.011
15°
15°
F
7°
MIN
1.00
0.95
0.05
0.45
0.17
0.64
0.09
0°
5°
5°
MILLIMETERS*
14.00 BSC
14.00 BSC
12.00 BSC
12.00 BSC
1.00 REF.
0.50 BSC
© 2006 Microchip Technology Inc.
NOM
1.10
1.00
0.10
0.15
0.22
0.60
0.89
3.5°
Revised 07-22-05
10°
10°
80
20
A2
MAX
1.14
1.20
1.05
0.15
0.75
0.20
0.27
15°
15°
7°