DSPIC30F6012A Microchip Technology Inc., DSPIC30F6012A Datasheet - Page 218

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DSPIC30F6012A

Manufacturer Part Number
DSPIC30F6012A
Description
Dspic30f6011a/6012a/6013a/6014a High-performance Digital Signal Controllers
Manufacturer
Microchip Technology Inc.
Datasheet

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dsPIC30F6011A/6012A/6013A/6014A
64-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS70143C-page 216
Note:
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
REF: Reference Dimension, usually without tolerance, for information purposes only.
JEDEC Equivalent: MS-026
Drawing No. C04-085
B
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
See ASME Y14.5M
p
Dimension Limits
#leads=n1
E1
E
Units
CH
n1
A2
E1
D1
A1
n
p
A
L
F
E
D
c
B
L
n
MIN
.039
.037
.002
.018
.463
.463
.390
.390
.005
.007
.025
2
1
Preliminary
0
5
5
D1
.039 REF.
INCHES
CH x 45°
NOM
D
.024
.394
.394
.020
.043
.039
.006
.472
.472
.007
.009
.035
3.5
64
16
10
10
A1
A
MAX
.047
.010
.030
.482
.482
.398
.398
.009
.045
.041
.011
F
15
15
7
MIN
11.75
11.75
0.64
1.00
0.95
0.05
0.45
9.90
9.90
0.13
0.17
0
5
5
MILLIMETERS*
1.00 REF.
© 2006 Microchip Technology Inc.
NOM
12.00
12.00
10.00
10.00
0.50
1.10
1.00
0.15
0.60
0.18
0.22
0.89
Revised 07-22-05
3.5
64
16
10
10
MAX
A2
12.25
12.25
10.10
10.10
1.14
1.20
1.05
0.25
0.75
0.23
0.27
15
15
7

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