EVX10AS008BGL ETC-unknow, EVX10AS008BGL Datasheet - Page 40

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EVX10AS008BGL

Manufacturer Part Number
EVX10AS008BGL
Description
Adc Single 2.2gsps 10-bit Lvds 152-pin Cbga
Manufacturer
ETC-unknow
Datasheet
8.7
8.7.1
8.7.2
8.7.3
8.7.4
8.7.5
40
ADC Main Functions
0811A–BDC–12/08
Out-of-range Bit (OR/ORB)
Bit Error Rate (BER)
Gray or Binary Output Data Format Select
Pattern Generator Function
Diode: Junction Temperature Monitoring
It goes to logical high state when the input exceeds the positive full-scale or falls below the negative full-
scale. When the analog input exceeds the positive full-scale, the digital outputs remain at high logical
state, with (OR,ORB) at logical one. When the analog input falls below the negative full-scale, the digital
outputs remain at logical low state, with (OR,ORB) at logical one again.
The EV10AS008B internal regeneration latches indecision (for inputs very close to latches threshold)
may produce errors in the logic encoding circuitry and leading to large amplitude output errors.
This is due to the fact that the latches are regenerating the internal analog residues into logical states
with a finite voltage gain value (Av) within a given positive amount of time D(t):
Av = exp(D(t)/τ), with τ the positive feedback regeneration time constant. By default D(t) is equal to half a
clock period.
at 2.2 Gsps.
It is possible for the user to choose between the binary or Gray output data format.
Digital Data format selection:
BINARY output format if B/GB is floating or GND.
Gray output format if B/GB is connected to
The Pattern Generator function (enabled by connecting pin A9 PGEB to
rapidly the ADC operation thanks to a checker board pattern delivered internally to the ADC. Each output
bit of the ADC should toggle from 0 to 1 successively, giving sequences such as 0101010101 (strobed
by falling edge of DR) and 1010101010 (strobed by rising edge of DR) every 2 clock cycles.
The diode pin is provided for junction temperature monitoring. If the user does not intend to use the die
junction temperature monitoring function, the diode pin (A10) has to be left either floating or connected to
ground.
Because of the use of one internal diode-mounted transistor (used for junction temperature monitoring),
the user has to implement external head-to-tail protection diodes to avoid potential reverse currents
flows which may damage the internal diode component.
The EV10AS008B has been designed for reducing the probability of occurrence of such errors to 10
V
CC
= +3.3V
.
V
CC
= +3.3V) allows to check
e2v semiconductors SAS 2008
EV10AS008B
–15

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