EVX10AS008BGL ETC-unknow, EVX10AS008BGL Datasheet - Page 27

• Manufacturer Part Number: EVX10AS008BGL
• Description: Adc Single 2.2gsps 10-bit Lvds 152-pin Cbga
• Manufacturer: ETC-unknow

Figure 5-3.
6. Equivalent Input/Output Schematics
Figure 6-1.
e2v semiconductors SAS 2008
50 µm thick Epoxy/Ag glue
21x21 mm CLGA
18.5x18.5 mm CuW on top
Thermal Net
Assumptions:
Die 3.75x3.84=14.4 mm2
Pb90Sn 10 columns diameter 0.86 mm
2.1 mm length under bottom of LGA
Analog Input Equivalent Schematics and ESD Protection
Note:
Package
Pins
VINB
VIN
Silicon Die
14.4 mm2
Epoxy/Ag glue
CuW heatspreader
CuW heatspreader
Ceramic package
Ceramic
columns PbSn
= 0.95 W/cm/˚C
= 0.02 W/cm/˚C
= 2.3 W/cm/˚C
= 2.3 W/cm/˚C
= 0.17 W/cm/˚C
= 0.40 W/cm/˚C
100Ω termination mid point is on-chip and DC coupled to ground.
impedance line
50Ω controlled
Silicon Junction
˚C/Watt
˚C/Watt
Bottom of 44
internal columns
0.56
2.05
(Package)
Bottom view
GND
0.5
0.6 ˚C/Watt
0.25 ˚C/Watt
1.7 ˚C/Watt
0.80 ˚C/Watt
3.0 ˚C/Watt
˚C/Watt
Bottom of 52
"between" columns
0.25 ˚C/Watt
˚C/Watt
˚C/Watt
0.47
1.75
0.9
˚C/Watt
GNDTA
VINB
VIN
Die Pads
Bottom
of 56 external columns
˚C/Watt
˚C/Watt
0.44
1.60
To external
heatsink if any
50Ω
50Ω
On Chip TaN resistors: 2% matching Tc < 10 ppm
2.61
Silicon Junction
1.7
0.6
0.80
3.0
0.25
0.5
2.22
at bottom of columns
Infinite heatsink
0.9
Case where all bottoms of columns
are connected to infinite heat sink at bottom
and no external heatsink on top
2.04
(Result using SPICE, thermal to
electrical equivalent model)
Reduction
ESD
ESD
at bottom of columns
Infinite heatsink
Junction
Silicon
EV10AS008B
0811A–BDC–12/08
7.4 ˚C/Watt
27