FDZ661PZ Fairchild Semiconductor, FDZ661PZ Datasheet

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FDZ661PZ

Manufacturer Part Number
FDZ661PZ
Description
Designed on Fairchild's advanced 1
Manufacturer
Fairchild Semiconductor
Datasheet
©2011 Fairchild Semiconductor Corporation
FDZ661PZ Rev.C
MOSFET Maximum Ratings
Thermal Characteristics
Package Marking and Ordering Information
FDZ661PZ
P-Channel 1.5 V Specified PowerTrench
-20 V, -2.6 A, 140 mΩ
Features
V
V
I
P
T
R
R
D
J
DS
GS
D
θJA
θJA
Max r
Max r
Max r
Max r
Occupies only 0.64 mm
area of 2 x 2 BGA
Ultra-thin package: less than 0.4 mm height when mounted
to PCB
HBM ESD protection level > 2 kV (Note3)
RoHS Compliant
, T
Symbol
Device Marking
STG
DS(on)
DS(on)
DS(on)
DS(on)
EH
= 140 mΩ at V
= 182 mΩ at V
= 231 mΩ at V
= 315 mΩ at V
Drain to Source Voltage
Gate to Source Voltage
Power Dissipation
Power Dissipation
Operating and Storage Junction Temperature Range
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
D
BOTTOM
S
2
of PCB area. Less than 16% of the
GS
GS
GS
GS
G
FDZ661PZ
-Continuous
= -4.5 V, I
= -2.5 V, I
= -1.8 V, I
= -1.5 V, I
-Pulsed
Device
S
D
D
D
D
Pin 1
= -2 A
= -1.5 A
= -1 A
= -1 A
T
A
= 25 °C unless otherwise noted
WL-CSP 0.8X0.8 Thin
WL-CSP 0.8X0.8 Thin
Parameter
Pin 1
Package
1
T
T
T
General Description
Designed on Fairchild's advanced 1.5 V PowerTrench
with state of the art "fine pitch" Thin WLCSP packaging process,
the FDZ661PZ minimizes both PCB space and r
advanced WLCSP MOSFET embodies a breakthrough in
packaging technology which enables the device to combine
excellent thermal transfer characteristics, ultra-low profile (0.4
mm) and small (0.8x0.8 mm
low r
Applications
A
A
A
= 25 °C
= 25 °C
= 25 °C
Battery management
Load switch
Battery protection
TOP
DS(on)
®
Thin WL-CSP MOSFET
.
Reel Size
7 ”
(Note 1a)
(Note 1b)
(Note 1a)
(Note 1a)
(Note 1b)
2
) packaging, low gate charge, and
Tape Width
8 mm
-55 to +150
Ratings
-2.6
311
-20
-10
1.3
0.4
±8
93
December 2011
www.fairchildsemi.com
5000 units
Quantity
DS(on)
®
process
Units
°C/W
. This
°C
W
V
V
A

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FDZ661PZ Summary of contents

Page 1

... General Description = -2 A Designed on Fairchild's advanced 1.5 V PowerTrench D with state of the art "fine pitch" Thin WLCSP packaging process the FDZ661PZ minimizes both PCB space and advanced WLCSP MOSFET embodies a breakthrough in D packaging technology which enables the device to combine = - excellent thermal transfer characteristics, ultra-low profile (0.4 mm) and small (0 ...

Page 2

... Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%. 3. The diode connected between the gate and source serves only as protection ESD. No gate overvoltage rating is implied. ©2011 Fairchild Semiconductor Corporation FDZ661PZ Rev °C unless otherwise noted J Test Conditions = -250 μ ...

Page 3

... 150 0.5 1 GATE TO SOURCE VOLTAGE (V) GS Figure 5. Transfer Characteristics ©2011 Fairchild Semiconductor Corporation FDZ661PZ Rev °C unless otherwise noted J μ PULSE DURATION = 80 s DUTY CYCLE = 0.5% MAX 2 3 600 450 300 150 50 75 100 125 150 o ( ...

Page 4

... V , GATE TO SOURCE VOLTAGE (V) GS Figure 9. Gate Leakage Current vs Gate to Source Voltage 1000 100 Figure 11. Single Pulse Maximum Power Dissipation ©2011 Fairchild Semiconductor Corporation FDZ661PZ Rev °C unless otherwise noted J 2000 1000 100 0.1 0. ...

Page 5

... Typical Characteristics 2 DUTY CYCLE-DESCENDING ORDER 0.5 0.2 0.1 0.05 0.1 0.02 0.01 0.01 0.001 - Figure 12. Junction-to-Ambient Transient Thermal Response Curve ©2011 Fairchild Semiconductor Corporation FDZ661PZ Rev °C unless otherwise noted J SINGLE PULSE 311 C/W θ RECTANGULAR PULSE DURATION (sec ...

Page 6

... Dimensional Outline and Pad Layout ©2011 Fairchild Semiconductor Corporation FDZ661PZ Rev.C 6 www.fairchildsemi.com ...

Page 7

... Definition of Terms Datasheet Identification Product Status Advance Information Formative / In Design Preliminary First Production No Identification Needed Full Production Obsolete Not In Production ©2011 Fairchild Semiconductor Corporation FDZ661PZ Rev.C ® tm ® PowerTrench SM PowerXS™ Programmable Active Droop™ ® QFET QS™ Quiet Series™ ...

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