AD6672 Analog Devices, AD6672 Datasheet - Page 29

• Manufacturer Part Number: AD6672
• Description: IF Receiver
• Manufacturer: Analog Devices

Specifications of AD6672

• Resolution (bits): 11bit
• # Chan: 1
• Sample Rate: 250MSPS
• Interface: LVDS
• Analog Input Type: Diff-Uni
• Ain Range: 1.75 V p-p
• Adc Architecture: Pipelined
• Pkg Type: CSP

APPLICATIONS INFORMATION
DESIGN GUIDELINES
Before starting system level design and layout of the AD6672,
it is recommended that the designer become familiar with these
guidelines, which discuss the special circuit connections and
layout requirements for certain pins.
Power and Ground Recommendations
When connecting power to the AD6672, it is recommended that
two separate 1.8 V supplies be used: use one supply for analog
(AVDD) and a separate supply for the digital outputs (DRVDD).
The designer can employ several different decoupling capacitors
to cover both high and low frequencies. Locate these capacitors
close to the point of entry at the PC board level and close to the
pins of the part with minimal trace length.
A single PCB ground plane should be sufficient when using the
AD6672. With proper decoupling and smart partitioning of the
PCB analog, digital, and clock sections, optimum performance
can be easily achieved.
Exposed Paddle Thermal Heat Slug Recommendations
It is mandatory that the exposed paddle on the underside of the
ADC be connected to analog ground (AGND) to achieve the
best electrical and thermal performance. A continuous, exposed
(no solder mask) copper plane on the PCB should mate to the
AD6672
The copper plane should have several vias to achieve the lowest
possible resistive thermal path for heat dissipation to flow
through the bottom of the PCB. These vias should be filled or
plugged with nonconductive epoxy.
To maximize the coverage and adhesion between the ADC
and the PCB, overlay a silkscreen to partition the continuous
plane on the PCB into several uniform sections. This provides
several tie points between the ADC and the PCB during the
reflow process. Using one continuous plane with no partitions
guarantees only one tie point between the ADC and the PCB.
See the evaluation board for a PCB layout example. For detailed
information about the packaging and PCB layout of chip scale
packages, refer to the
Manufacturing Guide for the Lead Frame Chip Scale Package
(LFCSP).
exposed paddle, Pin 0.
AN-772 Application
Note, A Design and
Rev. 0 | Page 29 of 32
VCM
Decouple the VCM pin to ground with a 0.1 μF capacitor, as
shown in Figure 26.
SPI Port
The SPI port should not be active during periods when the full
dynamic performance of the converter is required. Because the
SCLK, CSB, and SDIO signals are typically asynchronous to the
ADC clock, noise from these signals can degrade converter
performance. If the on-board SPI bus is used for other devices,
it may be necessary to provide buffers between this bus and the
AD6672
converter input pins during critical sampling periods.
to keep these signals from transitioning at the
AD6672