LM49101TM/NOPB National Semiconductor, LM49101TM/NOPB Datasheet - Page 27

• Manufacturer Part Number: LM49101TM/NOPB
• Description: IC AUDIO SUBSYSTM 1.3W AB 25USMD
• Manufacturer: National Semiconductor
• Series: Boomer®, PowerWise®r
• Type: Class ABr

Specifications of LM49101TM/NOPB

• Output Type: 1-Channel (Mono) with Stereo Headphones
• Max Output Power X Channels @ Load: 1.3W x 1 @ 8 Ohm; 45mW x 2 @ 32 Ohm
• Voltage - Supply: 2.7 V ~ 5.5 V
• Features: Depop, Differential Inputs, I²C, Shutdown, Thermal Protection, Volume Control
• Mounting Type: Surface Mount
• Package / Case: 25-MicroSMD
• Operational Class: Class-AB
• Audio Amplifier Output Configuration: 1-Channel Mono/2-Channel Stereo
• Audio Amplifier Function: Headphone/Speaker
• Single Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (typ): 3/5V
• Power Supply Requirement: Triple
• Rail/rail I/o Type: No
• Power Supply Rejection Ratio: 90dB
• Single Supply Voltage (min): Not RequiredV
• Single Supply Voltage (max): Not RequiredV
• Dual Supply Voltage (min): 1.7/1.8/2.7V
• Dual Supply Voltage (max): 2.9/5.5V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 25
• Package Type: uSMD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: LM49101TMTR

LM49101 Reference Demo Board Bill Of Materials
PCB Layout Guidelines
This section provides practical guidelines for mixed signal
PCB layout that involves various digital/analog power and
ground traces. Designers should note that these are only
"rule-of-thumb" recommendations and the actual results will
depend heavily on the final layout.
General Mixed Signal Layout
Recommendations
SINGLE-POINT POWER AND GROUND CONNECTIONS
The analog power traces should be connected to the digital
traces through a single point (link). A "Pi-filter" can be helpful
in minimizing high frequency noise coupling between the ana-
Designator
J
J
C
C
11
C
J
J
9
C
C
R
R
IN1
IN3
1
5
, J
, J
S1
, J
, J
S5
S3
S
C
1
3
R
U
J
J
10
, R
, R
, C
, C
, C
12
W1
, C
S2
, C
2
7
6
4
5
1
, J
, J
, J
, J
2
4
IN2
IN4
S4
B
1
3
8
14
13
100kΩ
Vlaue
5.1kΩ
2.2μF
0.1μF
2.2μF
10Ω
1μF
Tolerance
10%
10%
10%
10%
5%
1%
5%
TABLE 7. Bill Of Materials
0805, 16V, X7R Ceramic Capacitor
0603, 10V, X7R Ceramic Capacitor
0.100" 1x2 header, vertical mount
0.100" 1x3 header, vertical mount
1206, X7R Ceramic Capacitor
Size A, Tantalum Capacitor
Momentary Push Switch
27
1/10W, 0603 Resistors
1/10W, 0603 Resistors
1/10W, 0805 Resistor
Part Description
Headphone Jack
16 pin header
log and digital sections. It is further recommended to put
digital and analog power traces over the corresponding digital
and analog ground traces to minimize noise coupling.
PLACEMENT OF DIGITAL AND ANALOG COMPONENTS
All digital components and high-speed digital signals traces
should be located as far away as possible from analog com-
ponents and circuit traces.
AVOIDING TYPICAL DESIGN AND LAYOUT PROBLEMS
Avoid ground loops or running digital and analog traces par-
allel to each other (side-by-side) on the same PCB layer.
When traces must cross over each other do it at 90 degrees.
Running digital and analog traces at 90 degrees to each other
from the top to the bottom side as much as possible will min-
imize capacitive noise coupling and cross talk.
LM49101TM
V
Input, Output, V
DD
Selects, V
RESET function
I
2
C Connector
Comment
GND
DD
www.national.com
DD
, I
2
, GND
CV
DD
,