SC16C554IB64,151 NXP Semiconductors, SC16C554IB64,151 Datasheet - Page 52

• Manufacturer Part Number: SC16C554IB64,151
• Description: IC UART QUAD SOT314-2
• Manufacturer: NXP Semiconductors

Specifications of SC16C554IB64,151

• Number Of Channels: 4, QUART
• Fifo's: 16 Byte
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With Irda Encoder/decoder: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• With Cmos: Yes
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP
• Transmit Fifo: 16Byte
• Receive Fifo: 16Byte
• Transmitter And Receiver Fifo Counter: Yes
• Data Rate: 5Mbps
• Package Type: LQFP
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 4.5V
• Mounting: Surface Mount
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935270074151; SC16C554IB64-S; SC16C554IB64-S

Philips Semiconductors
9397 750 13132
Product data
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These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217 C
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or
larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than
0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex
foil by using a hot bar soldering process. The appropriate soldering profile can be provided on
request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Quad UART with 16-byte FIFO and infrared (IrDA) encoder/decoder
Rev. 05 — 10 May 2004
10 C measured in the atmosphere of the reflow
SC16C554/554D
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
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