SC16C652IB48,151 NXP Semiconductors, SC16C652IB48,151 Datasheet - Page 39

• Manufacturer Part Number: SC16C652IB48,151
• Description: IC UART DUAL W/FIFO 48-LQFP
• Manufacturer: NXP Semiconductors

Specifications of SC16C652IB48,151

• Features: 2 Channels
• Number Of Channels: 2, DUART
• Fifo's: 32 Byte
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With Irda Encoder/decoder: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• With Cmos: Yes
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Transmitter And Receiver Fifo Counter: Yes
• Data Rate: 5Mbps
• Package Type: LQFP
• Operating Supply Voltage (max): 5.5V
• Mounting: Surface Mount
• Pin Count: 48
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-3277; 935270032151; SC16C652IB48-S

Philips Semiconductors
13. Revision history
Table 31:
9397 750 11634
Product data
Rev Date
04
03
02
01
20030620
20030314
20021217
20020916
Revision history
CPCN
-
-
-
-
[3]
[4]
[5]
[6]
[7]
Description
Product data (9397 750 11634); ECN 853-2382 30032 of 16 June 2003.
Modifications:
Product data (9397 750 11195); ECN 853-2382 29621 of 07 March 2003.
Product data (9397 750 10816); ECN 853-2382 29261 of 06 December 2002.
Product data (9397 750 10335); ECN 853-2382 28948 of 16 September 2002.
•
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217 C
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Figure 3 “Crystal oscillator connection.” on page
added connection with resistor.
Rev. 04 — 20 June 2003
Dual UART with 32 bytes of transmit and receive FIFOs
10 C measured in the atmosphere of the reflow
11: changed capacitors’ values and
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
SC16C652
39 of 41