PCF2123BS/1 NXP Semiconductors, PCF2123BS/1 Datasheet - Page 58
PCF2123BS/1
Manufacturer Part Number
PCF2123BS/1
Description
Manufacturer
NXP Semiconductors
Datasheet
1.PCF2123BS1.pdf
(63 pages)
Specifications of PCF2123BS/1
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PCF2123BS/1
Manufacturer:
NXP
Quantity:
14 806
NXP Semiconductors
PCF2123
Product data sheet
Fig 41. Footprint information for reflow soldering of SOT402-1 (TSSOP14) package of PCF2123TS/1
Footprint information for reflow soldering of TSSOP14 package
DIMENSIONS in mm
0.650
P1
0.750
P2
7.200
Hy
Ay
solder land
occupied area
Gy
C
4.500
By
1.350
C
P2
D2 (4x)
0.400
D1
Refer to the package outline drawing for actual layout
All information provided in this document is subject to legal disclaimers.
0.600
D2
4.950
Rev. 5 — 27 April 2011
Gx
Generic footprint pattern
P1
5.300
Gy
Hx
Gx
5.800
Hx
7.450
Hy
(0.125)
D1
SPI Real time clock/calendar
(0.125)
By
PCF2123
Ay
© NXP B.V. 2011. All rights reserved.
sot402-1_fr
SOT402-1
58 of 63
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