PCF2123BS/1 NXP Semiconductors, PCF2123BS/1 Datasheet - Page 57

• Manufacturer Part Number: PCF2123BS/1
• Manufacturer: NXP Semiconductors

Specifications of PCF2123BS/1

• Lead Free Status / Rohs Status: Compliant

NXP Semiconductors
20. Footprint information for reflow soldering
PCF2123
Product data sheet
Fig 40. Footprint information for reflow soldering of SOT758-1 (HVQFN16) package of PCF2123BS/1
Footprint information for reflow soldering of HVQFN16 package
Dimensions in mm
Issue date
0.500
P
4.000
Ax
07-05-07
09-06-15
Hy
4.000
Ay
solder land
solder paste deposit
solder land plus solder paste
occupied area
Gy
(0.105)
2.200
Bx
2.200
By
0.900
C
C
D
Refer to the package outline drawing for actual layout
All information provided in this document is subject to legal disclaimers.
0.240
D
nSPy
Rev. 5 — 27 April 2011
1.500
SLx
Generic footprint pattern
nSPx
1.500
P
SLy
SPx tot
SLx
Hx
Gx
Bx
Ax
SPx tot
0.650
SPx
SPy tot
SPy
0.650
0.025
0.650
SPx
0.650
SPy
SPI Real time clock/calendar
3.300
Gx
0.025
SLy
3.300
Gy
By
PCF2123
© NXP B.V. 2011. All rights reserved.
Ay
4.250
nSPx
Hx
1
sot758-1_fr
SOT758-1
4.250
nSPy
Hy
1
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