PCF2123BS/1 NXP Semiconductors, PCF2123BS/1 Datasheet - Page 50

• Manufacturer Part Number: PCF2123BS/1
• Manufacturer: NXP Semiconductors

Specifications of PCF2123BS/1

• Lead Free Status / Rohs Status: Compliant

NXP Semiconductors
PCF2123
Product data sheet
Table 47.
Original dimensions are in mm.
[1]
[2]
[3]
[4]
Table 48.
All x/y coordinates represent the position of the center of each pad with respect to the center
(x/y = 0) of the chip; see
Unit (mm)
PCF2123U/12AA
max
nom
min
PCF2123U/12HA
max
nom
min
Symbol
SDO
SDI
SCL
CLKOE
CLKOUT
V
OSCI
CE
OSCO
TEST
INT
V
DD
SS
Nominal die thickness. Compare with wafer thickness given in
Dimension includes saw lane.
P
P
1
2
and P
and P
Dimensions of PCF2123U/12
Bump locations of all PCF2123U types
3
4
: pad size.
: bump size.
A
-
0.22
-
-
0.17
-
[1]
All information provided in this document is subject to legal disclaimers.
A
0.018
0.015
0.012
0.018
0.015
0.012
1
Figure 33
Bump
1
2
3
4
5
6
7
8
9
10
11
12
Rev. 5 — 27 April 2011
A
-
0.2
-
-
0.15
-
2
[1]
and
Figure
D
-
1.492
-
-
1.492
-
[2]
34.
E
-
1.449
-
-
1.449
-
[2]
Coordinates
x
648.0
648.0
648.0
648.0
648.0
648.0
−648.0
−648.0
−648.0
−648.0
−648.0
−648.0
e
1.296
-
0.198
1.296
-
0.198
Table
SPI Real time clock/calendar
50.
P
-
0.09
-
-
0.09
-
1
[3]
P
0.084
0.081
0.078
0.084
0.081
0.078
y
−575.0
−377.0
−179.0
171.2
369.2
625.7
639.0
421.9
−25.9
−223.9
−441.0
−639.0
2
[4]
PCF2123
© NXP B.V. 2011. All rights reserved.
P
-
0.09
-
-
0.09
-
3
[3]
P
0.084
0.081
0.078
0.084
0.081
0.078
50 of 63
4
[4]