PCF2123BS/1 NXP Semiconductors, PCF2123BS/1 Datasheet - Page 5

• Manufacturer Part Number: PCF2123BS/1
• Manufacturer: NXP Semiconductors

Specifications of PCF2123BS/1

• Lead Free Status / Rohs Status: Compliant

NXP Semiconductors
Table 3.
[1]
[2]
PCF2123
Product data sheet
Symbol
OSCI
OSCO
n.c.
TEST
INT
CE
V
SDO
SDI
SCL
CLKOE
CLKOUT 12
V
SS
DD
The die paddle (exposed pad) is wired to V
The substrate (rear side of the die) is wired to V
Pin
HVQFN16
(PCF2123BS/1)
16
1
6, 7, 14, 15
2
3
4
5
8
9
10
11
13
Pin description
[1]
7.2 Pin description
1
2
3, 11
4
8
9
10
TSSOP14
(PCF2123TS/1)
5
6
7
12
13
14
All information provided in this document is subject to legal disclaimers.
SS
and should be electrically isolated.
PCF2123Ux
(bare die)
7
8
-
9
10
11
12
1
2
3
4
5
6
SS
[2]
and should be electrically isolated.
Rev. 5 — 27 April 2011
Description
oscillator input; high-impedance node; minimize wire length
between quartz and package
oscillator output; high-impedance node; minimize wire length
between quartz and package
do not connect and do not use as feed through; connect to
V
test pin; not user accessible; connect to V
(internally pulled down)
interrupt output (open-drain; active LOW)
chip enable input (active HIGH) with internal pull down
ground
serial data output, push-pull; high-impedance when not
driving; can be connected to SDI for single wire data line
serial data input; may float when CE is inactive
serial clock input; may float when CE is inactive
CLKOUT enable or disable pin; enable is active HIGH
oscillator performance; recommend 100 nF decoupling close
to the device (see
clock output (open-drain)
supply voltage; positive or negative steps in V
DD
if floating pins are not allowed
Figure
29)
SPI Real time clock/calendar
PCF2123
© NXP B.V. 2011. All rights reserved.
SS
or leave floating
DD
may affect
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