PCF2123BS/1 NXP Semiconductors, PCF2123BS/1 Datasheet - Page 2

• Manufacturer Part Number: PCF2123BS/1
• Manufacturer: NXP Semiconductors

Specifications of PCF2123BS/1

• Lead Free Status / Rohs Status: Compliant

NXP Semiconductors
4. Ordering information
Table 1.
[1]
[2]
[3]
5. Marking
PCF2123
Product data sheet
Type number
PCF2123BS/1
PCF2123TS/1
PCF2123U/5GA/1
PCF2123U/10AA/1
PCF2123U/12AA/1
PCF2123U/12HA/1
Unsawn wafer.
Sawn 6 inch wafer on Film Frame Carrier (FFC) for 6 inch wafer, see
Sawn 6 inch wafer with gold bumps on Film Frame Carrier (FFC) for 8 inch wafer, see
Ordering information
wire bond die
wire bond die
WLCSP12
Package
Name
HVQFN16
TSSOP14
WLCSP12
Table 2.
Type number
PCF2123BS/1
PCF2123TS/1
PCF2123U/5GA/1
PCF2123U/10AA/1
PCF2123U/12AA/1
PCF2123U/12HA/1
Marking codes
All information provided in this document is subject to legal disclaimers.
Description
plastic thermal enhanced very thin quad flat package;
no leads; 16 terminals; body 3 × 3 × 0.85 mm
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
12 bonding pads
12 bonding pads
wafer level chip size package; 12 bumps
wafer level chip size package; 12 bumps
Rev. 5 — 27 April 2011
[1]
[2]
Figure 37 on page
Marking code
123
PCF2123
PC2123-1
PC2123-1
PC2123-1
PC2123-1
Figure 38 on page
53.
[3]
[3]
SPI Real time clock/calendar
53.
PCF2123
© NXP B.V. 2011. All rights reserved.
Version
SOT758-1
SOT402-1
PCF2123U/10
PCF2123U/10
PCF2123U/12
PCF2123U/12
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