PCF2123BS/1 NXP Semiconductors, PCF2123BS/1 Datasheet - Page 46

• Manufacturer Part Number: PCF2123BS/1
• Manufacturer: NXP Semiconductors

Specifications of PCF2123BS/1

• Lead Free Status / Rohs Status: Compliant

NXP Semiconductors
Fig 31. Package outline SOT402-1 (TSSOP14) of PCF2123TS/1
PCF2123
Product data sheet
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
OUTLINE
VERSION
SOT402-1
max.
1.1
A
0.15
0.05
A
1
0.95
0.80
14
A
1
2
y
IEC
0.25
Z
pin 1 index
A
e
3
D
0.30
0.19
b
p
All information provided in this document is subject to legal disclaimers.
MO-153
JEDEC
0.2
0.1
c
b
p
8
7
REFERENCES
D
5.1
4.9
0
(1)
Rev. 5 — 27 April 2011
w
M
E
4.5
4.3
(2)
JEITA
scale
0.65
2.5
e
c
A
H
6.6
6.2
2
E
A
1
5 mm
L
1
0.75
0.50
L
H
p
E
E
detail X
0.4
0.3
Q
L
L
PROJECTION
EUROPEAN
p
SPI Real time clock/calendar
0.2
v
Q
A
(A )
0.13
3
w
X
θ
v
PCF2123
0.1
A
y
© NXP B.V. 2011. All rights reserved.
M
ISSUE DATE
A
99-12-27
03-02-18
0.72
0.38
Z
(1)
SOT402-1
8
0
θ
o
o
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