A3P125-QNG132 MICROSEMI, A3P125-QNG132 Datasheet - Page 37
A3P125-QNG132
Manufacturer Part Number
A3P125-QNG132
Description
Manufacturer
MICROSEMI
Datasheet
1.A3P125-QNG132.pdf
(144 pages)
Specifications of A3P125-QNG132
Lead Free Status / Rohs Status
Compliant
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Table 2-29 • I/O Short Currents I
The length of time an I/O can withstand I
reliability data below is based on a 3.3 V, 12 mA I/O setting, which is the worst case for this type of
analysis.
For example, at 110°C, the short current condition would have to be sustained for more than three
months to cause a reliability concern. The I/O design does not contain any short circuit protection, but
such protection would only be needed in extremely prolonged stress conditions.
Table 2-30 • Duration of Short Circuit Event before Failure
3.3 V LVTTL / 3.3 V LVCMOS
2.5 V LVCMOS
1.8 V LVCMOS
1.5 V LVCMOS
3.3 V PCI/PCI-X
*
Temperature
–40°C
0°C
25°C
70°C
85°C
100°C
110°C
125°C
135°
T
J
= 100°C
Applicable to Standard Plus I/O Banks
OSH
/I
OSL
Per PCI/PCI-X specification
OSH
R e v i s i o n 1
/I
Drive Strength
OSL
12 mA
16 mA
12 mA
2 mA
4 mA
6 mA
8 mA
2 mA
6 mA
2 mA
4 mA
6 mA
8 mA
2 mA
4 mA
events depends on the junction temperature. The
Automotive ProASIC3 Flash Family FPGAs
Time before Failure
> 20 years
> 20 years
> 20 years
6 months
3 months
25 days
12 days
5 years
2 years
I
OSL
109
109
109
27
27
54
54
18
37
74
22
44
44
16
33
11
(mA)*
I
OSH
103
103
103
25
25
51
51
16
32
65
17
35
35
13
25
9
(mA)*
2- 25
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