HD6473837FV Renesas Electronics America, HD6473837FV Datasheet - Page 58
HD6473837FV
Manufacturer Part Number
HD6473837FV
Description
IC H8/3837 MCU FLASH 100QFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Lr
Datasheet
1.HD6473837HV.pdf
(562 pages)
Specifications of HD6473837FV
Core Processor
H8/300L
Core Size
8-Bit
Speed
5MHz
Connectivity
SCI
Peripherals
LCD, PWM
Number Of I /o
84
Program Memory Size
60KB (60K x 8)
Program Memory Type
OTP
Eeprom Size
-
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 12x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-BQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HD6473837FV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
HD6473837FV
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
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2.6
CPU operation is synchronized by a system clock ( ) or a subclock (
clock signals see section 4, Clock Pulse Generators. The period from a rising edge of or
the next rising edge is called one state. A bus cycle consists of two states or three states. The cycle
differs depending on whether access is to on-chip memory or to on-chip peripheral modules.
2.6.1
Access to on-chip memory takes place in two states. The data bus width is 16 bits, allowing access
in byte or word size. Figure 2.11 shows the on-chip memory access cycle.
Internal address bus
Internal read signal
Internal data bus
(read access)
Internal write signal
Internal data bus
(write access)
Basic Operational Timing
Access to On-Chip Memory (RAM, ROM)
or
SUB
Figure 2.11 On-Chip Memory Access Cycle
T
1
state
Bus cycle
Address
Write data
Read data
T
2
state
SUB
). For details on these
SUB
to
41
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