HD6473837FV Renesas Electronics America, HD6473837FV Datasheet - Page 258

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HD6473837FV

Manufacturer Part Number
HD6473837FV
Description
IC H8/3837 MCU FLASH 100QFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Lr
Datasheet

Specifications of HD6473837FV

Core Processor
H8/300L
Core Size
8-Bit
Speed
5MHz
Connectivity
SCI
Peripherals
LCD, PWM
Number Of I /o
84
Program Memory Size
60KB (60K x 8)
Program Memory Type
OTP
Eeprom Size
-
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 12x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-BQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6473837FV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
HD6473837FV
Manufacturer:
RENESAS
Quantity:
3 172
Part Number:
HD6473837FV
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Data Transfer Format
Figure 10.4 and figure 10.5 show the SCI2 data transfer format. Data is sent and received starting
from the least significant bit, in LSB-first format. Transmit data is output from one falling edge of
the serial clock until the next falling edge. Receive data is latched at the rising edge of the serial
clock.
When SCI2 operates on an internal clock, a gap can be inserted between each byte of transferred
data and the next, as shown in figure 10.5. During this gap, pin SCK 2 output remains high. Also, a
strobe pulse can be output at pin STRB.
The length of the gap is designated in bits GAP1 and GAP0 in serial control register 2 (SCR2).
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