LPC4310FET100,551 NXP Semiconductors, LPC4310FET100,551 Datasheet - Page 138
LPC4310FET100,551
Manufacturer Part Number
LPC4310FET100,551
Description
IC MCU 32BIT 100TFBGA
Manufacturer
NXP Semiconductors
Series
LPC43xxr
Datasheet
1.LPC4310FET100551.pdf
(145 pages)
Specifications of LPC4310FET100,551
Core Processor
ARM® Cortex™-M4/M0
Core Size
32-Bit Dual-Core
Speed
150MHz
Connectivity
CAN, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number Of I /o
64
Program Memory Size
-
Program Memory Type
ROMless
Eeprom Size
-
Ram Size
168K x 8
Voltage - Supply (vcc/vdd)
2.2 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TFBGA
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC4310FET100,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
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NXP Semiconductors
LPC4350_30_20_10
Objective data sheet
Fig 53. Reflow soldering of the LQFP100 package
Footprint information for reflow soldering of LQFP100 package
DIMENSIONS in mm
0.500
P1
0.560
P2
17.300 17.300 14.300 14.300
Hy
Ax
solder land
occupied area
Gy
Ay
C
Bx
By
Refer to the package outline drawing for actual layout
All information provided in this document is subject to legal disclaimers.
P2
1.500
C
D2 (8×)
Rev. 2.1 — 23 September 2011
0.280
Generic footprint pattern
D1
0.400 14.500 14.500 17.550 17.550
P1
D2
Hx
Gx
Bx
Ax
Gx
(0.125)
Gy
32-bit ARM Cortex-M4/M0 microcontroller
Hx
D1
LPC4350/30/20/10
Hy
By
© NXP B.V. 2011. All rights reserved.
Ay
SOT407-1
sot407-1
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