PCF8576DT NXP Semiconductors, PCF8576DT Datasheet - Page 46

PCF8576DT

Manufacturer Part Number
PCF8576DT
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PCF8576DT

Operating Supply Voltage (typ)
2.5/3.3/5V
Number Of Digits
20
Number Of Segments
160
Package Type
TSSOP
Pin Count
56
Mounting
Surface Mount
Power Dissipation
400mW
Frequency (max)
400KHz
Operating Supply Voltage (min)
1.8V
Operating Supply Voltage (max)
5.5V
Lead Free Status / Rohs Status
Supplier Unconfirmed

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NXP Semiconductors
PCF8576D_9
Product data sheet
18.3.1 Stand off
Table 25.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
For further information on temperature profiles, refer to application note AN10365
“Surface mount reflow soldering description” .
The stand off between the substrate and the chip is determined by:
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
Fig 32. Temperature profiles for large and small components
Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classified in accordance with
The amount of printed solder on the substrate
The size of the solder land on the substrate
temperature
MSL: Moisture Sensitivity Level
Lead-free process (from J-STD-020C)
Figure
32.
Rev. 09 — 25 August 2009
= minimum soldering temperature
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
3
)
Universal LCD driver for low multiplex rates
260
250
245
350 to 2000
Table
25.
temperature
peak
PCF8576D
> 2000
260
245
245
© NXP B.V. 2009. All rights reserved.
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