PCF8576DT NXP Semiconductors, PCF8576DT Datasheet - Page 45

• Manufacturer Part Number: PCF8576DT
• Manufacturer: NXP Semiconductors

Specifications of PCF8576DT

• Operating Supply Voltage (typ): 2.5/3.3/5V
• Number Of Digits: 20
• Number Of Segments: 160
• Package Type: TSSOP
• Pin Count: 56
• Mounting: Surface Mount
• Power Dissipation: 400mW
• Frequency (max): 400KHz
• Operating Supply Voltage (min): 1.8V
• Operating Supply Voltage (max): 5.5V
• Lead Free Status / Rohs Status: Supplier Unconfirmed

NXP Semiconductors
18. Soldering of WLCSP packages
PCF8576D_9
Product data sheet
18.1 Introduction to soldering WLCSP packages
18.2 Board mounting
18.3 Reflow soldering
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface
mount reflow soldering description” .
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
Board mounting of a WLCSP requires several steps:
Key characteristics in reflow soldering are:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reflow soldering itself
Fig 31. Temperature profiles for large and small components
•
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
temperature
MSL: Moisture Sensitivity Level
Rev. 09 — 25 August 2009
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
Universal LCD driver for low multiplex rates
Figure
32) than a PbSn process, thus
temperature
peak
PCF8576D
© NXP B.V. 2009. All rights reserved.
001aac844
time
45 of 52