NOIS1SM0250A-HHC ON Semiconductor, NOIS1SM0250A-HHC Datasheet - Page 21

• Manufacturer Part Number: NOIS1SM0250A-HHC
• Manufacturer: ON Semiconductor

Specifications of NOIS1SM0250A-HHC

• Lead Free Status / Rohs Status: Supplier Unconfirmed

The following case is not treated as “intentional content”:
A case that the above material is contained as an impurity into
raw materials or parts of the intended product. The impurity is
Acceptance Criteria Specification
The Product Acceptance Criteria is available on request. This document contains the criteria to which the IBIS5-1300 is tested before
being shipped.
Acronyms
ADC
CIS
CMOS
CY
DC
DNL
DS
DSNU
ESD
FF
FPN
FPS
FS
fs
I/O
IMG
INL
IP
LDO
LSB
LVDS
MBS
Acronym
complementary metal oxide semiconductor
dark signal nonuniformity
fill factor
input/output
integral nonlinearity
intellectual property
mixed boundary scan
analog to digital convertor
CMOS image sensor
Cypress
dark current
differential nonlinearity
double sampling
electrostatic discharge
fixed pattern noise
frames per second
frame start
full scale
image
low drop-out
least significant bit
low voltage differential signaling
Definition
Rev. 7 | www.onsemi.com | Page 21 of 22
defined as a substance that cannot be removed industrially, or it
is produced at a process such as chemical composing or
reaction and it cannot be removed technically.
MBPS
MCIS
MFF
MIM
MP
Mrad
MSB
MSPS
MTF
MUX
PCB
PLL
PLS
PRBS
PRNU
PSN
PSNL
QC
QE
QFW
RMS
ROI
Acronym
megabit per second
multifield point CMOS image sensor
metal fill factor
metal-insulator-metal
megapixel
megaradiation
most significant bit
megasamples per second
modulation transfer function
multiplexer
printed circuit board
phase-locked loop
parasitic light sensitivity
pseudo random bit stream
photo response nonuniformity
photon shot noise
pixel storage node leakage
quantum conversion
quantum efficiency
pixel full-well charge
root mean square
region of interest
Definition
NOIS1SM0250A