NOIS1SM0250A-HHC ON Semiconductor, NOIS1SM0250A-HHC Datasheet - Page 19

• Manufacturer Part Number: NOIS1SM0250A-HHC
• Manufacturer: ON Semiconductor

Specifications of NOIS1SM0250A-HHC

• Lead Free Status / Rohs Status: Supplier Unconfirmed

Die Alignment
The die is aligned manually in the package to a tolerance of ±50 m and the alignment is verified after hardening the die adhesive.
All dimensions in
Section A
A
Pin 1
Figure 14
0.508+0.051
Die Cavity:
A -
are in mm.
Bonding Cavity:
0.508+0.051
Rev. 7 | www.onsemi.com | Page 19 of 22
68 μ
Figure 14. Die Alignment
Center of
Drawing Not to Scale
Silicium
0.508+0.01
Die:
Offset Between Center of
Silicium and Center of
Cavity:
X: 0
Y: 68 μm
Center of Cavity
and of FPA
Glass Window:
1.0+/-0.05
Window Adhesive:
Die Adhesive:
NOIS1SM0250A
0.08+0.02
0.08+0.02
A
Parallelism in
X and Y within
+ 50 μm