MCZ33989EG Freescale Semiconductor, MCZ33989EG Datasheet - Page 63

• Manufacturer Part Number: MCZ33989EG
• Description: IC SYSTEM BASIS CHIP CAN 28-SOIC
• Manufacturer: Freescale Semiconductor

Specifications of MCZ33989EG

• Applications: *
• Interface: *
• Voltage - Supply: *
• Package / Case: 28-SOIC (7.5mm Width)
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Device on Thermal Test Board
Analog Integrated Circuit Device Data
Freescale Semiconductor
Material:
Outline:
Area A:
Ambient Conditions:
V2CTRL
VDD1
VSUP
GND
GND
GND
GND
RST
HS1
INT
RX
TX
V2
L0
18.0 mm x 7.5 mm Body
33989 Pin Connections
28-Pin SOICW
1.27 mm Pitch
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
80 mm x 100 mm board area, including
edge connector for thermal testing
Cu heat-spreading areas on board
surface
Natural convection, still air
28
27
26
25
24
23
22
21
20
19
18
17
16
15
WD
CS
MOSI
MISO
SCLK
GND
GND
GND
GND
CANL
CANH
L3
L2
L1
Figure 63. Thermal Test Board
A
Table 37. Thermal Resistance Performance
ambient air.
Thermal Resistance
R
θ
JA
R
is the thermal resistance between die junction and
θ
JA
Area A (mm
THERMAL ADDENDUM (REV 2.0)
300
600
ADDITIONAL DOCUMENTATION
0
2
)
°C/W
68
52
47
33989
63