HSDL-7002 Lite-On Electronics, HSDL-7002 Datasheet
HSDL-7002
Specifications of HSDL-7002
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HSDL-7002 Summary of contents
Page 1
... InfraRed) Encode and SIR Decode blocks. It also contains a sequential block Clock Divide that synthesizes the required internal signal. The HSDL-7002 can be placed into the Internal Clock Mode or External Clock Mode. An external crystal is needed for the Internal Clock Mode. In applications where the external 16XCLK signal is provided, a crystal is not needed ...
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... PIN #1 CORNER Pin 12 Pin 1 Pin 2 Pin 11 Pin 3 Pin 10 Pin 4 Pin 9 Figure 2. HSDL-7002 Pin Configuration I/O Pins Configuration Table Name Type 1 TXD Digital In 2 RXD Digital Out 3 A0 Digital Digital Digital In 6 CLK_SEL Digital In 7 GND 8 NRST Digital In 9 IR_RXD Digital In 10 IR_TXD ...
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Absolute Maximum Ratings Parameter Storage Temperature Operating Temperature Output Current [1] Power Dissipation [2] Input/Output Voltage Power Supply Voltage Electrostatic Protection Note: 1. All pins are protected from damage to static discharge by internal diode clamps to Vcc and GND. ...
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... IrDA Parameter. The Max Clk Frequency represents the maximum clock frequency to drive the HSDL-7002’s internal state machine. Under normal circumstances, the clock input should not exceed 16*115.2 kbit/s or 1.8432 MHz. This product can operate at higher clock rates, but the above is the recommended rate ...
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... HSDL-7002 Package Dimensions Figure 3. HSDL-7002 Package Dimensions N b Min. Nom. Max. Min. Nom. Max. Min. Nom. Max. 16L 0.25 0.28 0.33 2.05 2.10 Symbol Dimension in mm Minimum Nominal A - 0.80 A1 0.00 0.02 A3 0.20 REF. D 3.85 4.00 E 3.85 4.00 JEDEC PIN ASSIGNMENT PIN 1 ...
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... HSDL-7002 Tape Dimensions HSDL-7002 Reel Dimensions Detail A LABEL 6 "B" "C" Quantity 330 2500 80 Unit: mm 2.0 ± 0 ∅13.0 ± 0.5 R1.0 21 ± 0.8 Detail A 16 2.0 ± 0.5 ...
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... HSDL-7002 Moisture Proof Packaging All HSDL-7002 options are shipped in moisture proof pack- age. Once opened, moisture absorption begins. This part is compliant to JEDEC MSL (Moisture Sensetive Level ) 3. Baking Conditions If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. ...
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... TheDT/Dtime rates are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and HSDL-7002 castella- tion pins are heated to a temperature of 160°C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 4° ...
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... IR_RXD RXD OSCIN 3.6864 MHz Note: POWERDN can be used as a basic chip select. The HSDL-7002 will not be able to receive or transmit data while POWERDN is asserted. Figure 6. HSDL-7002 Connection between a Microcontroller and HSDL-3201 Selection of Internal Clock Rate from Crystal Oscillator Selected A2 A1 Clock Rate ...
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... IRRXD 3 CS RXD Figure 8. HSDL-7002 Decoding Scheme Notes: 1. The stretched pulse must be at least ¾ bit time in duration to be correctly interpreted by a UART recommended that the TXD remains high when not transmitting. This ensures the LED is off and will not interfere with signal reception ...
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Monoshot Operation CRYSTAL CLK INT CLK (DIV BY 2) TXD INTERNAL IRTXD OUTPUT IRTXD (MONOSHOT) The figure above illustrates the operation of the monoshot when the internal clock is set to divide by 2 mode, ...