HSDL-3209-021 Lite-On Electronics, HSDL-3209-021 Datasheet
HSDL-3209-021
Specifications of HSDL-3209-021
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HSDL-3209-021 Summary of contents
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... Data Compliant Low Power 115.2 kbit/s Infrared Transceiver Data Sheet Description The HSDL-3209 is an ultra-small low cost infrared trans- ceiver module that provides the interface between logic and infrared (IR) signals for through air, serial, half-duplex IR data link designed to interface to input/output logic circuits as low as 1.5V. The module is compliant to IrDA Physical Layer Specifications version 1 ...
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... Order Information Part Number HSDL-3209-021 I/O Pins Configuration Table Pin Symbol Description 1 LED A LED Anode 2 RXD Receive Data 3 TXD Transmit Data 4 SD Shutdown 5 IOVcc Input/Output ASIC Vcc 6 Vcc Supply Voltage 7 GND Ground Recommended Application Circuit Components Component R1 CX1, CX4 CX2, CX3 Notes: 1 ...
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Absolute Maximum Ratings For implementations where case to ambient thermal resistance is ≤ 50°C/W. Parameter Storage Temperature Operating Temperature LED Anode Voltage Supply Voltage Input/Output Voltage Input Voltage : SD Input Voltage : TXD DC LED Transmit Current Peak LED ...
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Electrical & Optical Specifications Specifications (Min. & Max. values) hold over the recommended operating conditions unless otherwise noted. Un- specified test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25°C with Vcc set to ...
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V OH 90% 50% 10 Figure 2. RXD output waveform. TXD LED t pw (MAX.) Figure 4. TXD “stuck on” protection waveform. SD TXD TX LIGHT t TW Figure 6. TXD wakeup time waveform. ...
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... HSDL-3209 Package Outline with Mechanical Dimensions 3.50 7.00 0.95 5.10 R1.10 R1.10 IOVcc Vcc LEDA RXD TXD SD 0.95 ± 0.05 (6x) Notes : 1. ALL DIMENSIONS IN MILLIMETERS (mm). 2. DIMENSION TOLERANCE IS 0.2mm UNLESS OTHERWISE SPECIFIED. Mounting Centre 0.95 PCB solder pad length PCB GND 0.60 ± 0.05 (7x) ...
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... HSDL-3209 Tape and Reel Dimensions Unit: mm POLARITY Pin 7: GND Pin 1: LEDA 7.35 ± 0.1 0.3 ± 0.05 2.93 ± 0.1 1.78 ± 0.1 Empty Parts Mounted (40mm min) Detail A LABEL 4.0 ± 0.1 2.0 ± 0.1 ∅1.5 +0.1 0 4.0 ± 0.1 ...
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... Moisture Proof Packaging All HSDL-3209 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 3. Yes No Baking Is Necessary Perform Recommended Baking Conditions: If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. ...
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... The DT/Dtime rates are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and HSDL-3209 castella- tion pins are heated to a temperature of 160°C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 4° ...
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Appendix A: SMT Assembly Application Note 1.0 Solder Pad, Mask and Metal Stencil Aperture STENCIL APERTURE SOLDER MASK Stencil and PCBA 1.1 Recommended Land Pattern C L Mounting Center 0.10 1.75 0.60 0.95 Unit METAL STENCIL FOR SOLDER ...
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Recommended Metal Solder Stencil Aperture It is recommended that only a 0.152 mm (0.006 inches 0.127 mm (0.005 inches) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and ...
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... Appendix B: PCB Layout Suggestion The HSDL 3209 is a shieldless part and hence does not contain a shield trace unlike the other transceivers. The following PCB layout guidelines should be followed to obtain a good PSRR and EM immunity resulting in good electrical performance. Things to note: 1. The ground plane should be continuous under the part ...
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... It is fully compliant to IrDA 1.4 low power specification from 9.6 kb/s to 115.2 kb/s, and supports HP- SIR and TV Remotes modes. The design of the HSDL-3209 also includes the following unique features: - Low passive component count. ...
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... The depth of the LED image inside the HSDL-3208 3.17mm. ‘A’ is the required half angle for viewing. For IrDA compliance, the minimum is 15° and the maximum is 30°. ...
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Aperture Width (X) vs Module Depth Aperture Height(Y) vs Module Depth Window Material Almost any plastic material ...
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Shape of the Window From an optics standpoint, the window should be flat. This ensures that the window will not alter either the radiation pattern of the LED, or the receive pattern of the photodiode. If the window must be ...