PSMN0R9-25YLC,115 NXP Semiconductors, PSMN0R9-25YLC,115 Datasheet - Page 9

MOSFET Power N-Ch 25V 0.99 mOhms

PSMN0R9-25YLC,115

Manufacturer Part Number
PSMN0R9-25YLC,115
Description
MOSFET Power N-Ch 25V 0.99 mOhms
Manufacturer
NXP Semiconductors
Series
-r
Datasheet

Specifications of PSMN0R9-25YLC,115

Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
0.99 mOhms
Drain-source Breakdown Voltage
25 V
Gate-source Breakdown Voltage
20 V
Continuous Drain Current
100 A
Power Dissipation
137 W
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Package / Case
LFPAK
Gate Charge Qg
110 nC
Minimum Operating Temperature
- 55 C
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
0.99 mOhm @ 25A, 10V
Drain To Source Voltage (vdss)
25V
Current - Continuous Drain (id) @ 25° C
100A
Vgs(th) (max) @ Id
1.95V @ 1mA
Gate Charge (qg) @ Vgs
110nC @ 10V
Input Capacitance (ciss) @ Vds
6775pF @ 12V
Power - Max
137W
Mounting Type
Surface Mount
Lead Free Status / Rohs Status
 Details
Other names
934065074115
NXP Semiconductors
PSMN0R9-25YLC
Product data sheet
Fig 12. Drain-source on-state resistance as a function
Fig 14. Gate charge waveform definitions
(m)
R
DS on
5
4
3
2
1
0
of drain current; typical values
0
V
V
V
V
GS(pl)
DS
GS(th)
GS
Q
25
GS1
2.4
I
Q
D
N-channel 25 V 0.99 mΩ logic level MOSFET in LFPAK using NextPower technology
GS
Q
GS2
50
Q
G(tot)
Q
GD
4.5
75
V
GS
All information provided in this document is subject to legal disclaimers.
2.6
003a a f 526
003aaa508
I
(V) = 2.8
D
(A)
3.5
3.0
10
100
Rev. 2 — 4 July 2011
Fig 13. Normalized drain-source on-state resistance
Fig 15. Gate-source voltage as a function of gate
V
(V)
GS
a
1.5
0.5
10
2
1
0
8
6
4
2
0
-60
factor as a function of junction temperature
charge; typical values
0
30
0
PSMN0R9-25YLC
5V
V
GS
=4.5V
60
60
12V
V
DS
120
90
= 20V
© NXP B.V. 2011. All rights reserved.
10V
003a a f 527
003a a f 533
Q
T
G
j
( C)
(nC)
180
120
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