FDMC8200S Fairchild Semiconductor, FDMC8200S Datasheet

MOSFET Power 30V Dual N-Channel PowerTrench MOSFET

FDMC8200S

Manufacturer Part Number
FDMC8200S
Description
MOSFET Power 30V Dual N-Channel PowerTrench MOSFET
Manufacturer
Fairchild Semiconductor
Datasheet

Specifications of FDMC8200S

Transistor Polarity
Dual N-Channel
Resistance Drain-source Rds (on)
20 mOhms
Forward Transconductance Gfs (max / Min)
43 S
Drain-source Breakdown Voltage
30 V
Continuous Drain Current
18 A
Power Dissipation
2.5 W
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Package / Case
Power 33
Module Configuration
Dual
Continuous Drain Current Id
18A
Drain Source Voltage Vds
30V
On Resistance Rds(on)
0.02ohm
Rds(on) Test Voltage Vgs
10V
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
FDMC8200S
Manufacturer:
FAIRCHILD/仙童
Quantity:
20 000
FDMC8200S Rev.C4
©2011 Fairchild Semiconductor Corporation
MOSFET Maximum Ratings
Thermal Characteristics
Package Marking and Ordering Information
FDMC8200S
Dual N-Channel PowerTrench
30 V, 10 mΩ, 20 mΩ
Features
Q1: N-Channel
Q2: N-Channel
V
V
I
E
P
T
R
R
R
D
J
DS
GS
AS
D
θJA
θJA
θJC
Max r
Max r
Max r
Max r
RoHS Compliant
, T
Symbol
Device Marking
Pin 1
STG
FDMC8200S
DS(on)
DS(on)
DS(on)
DS(on)
= 20 mΩ at V
= 32 mΩ at V
= 10 mΩ at V
= 13.5 mΩ at V
G1
Drain to Source Voltage
Gate to Source Voltage
Drain Current -Continuous (Package limited)
Single Pulse Avalanche Energy
Power Dissipation for Single Operation
Power Dissipation for Single Operation
Operating and Storage Junction Temperature Range
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Case
D1
Bottom
D1
D1
G2
D1
GS
GS
GS
GS
S2
FDMC8200S
= 10 V, I
= 4.5 V, I
= 10 V, I
-Continuous (Silicon limited)
-Pulsed
-Continuous
= 4.5 V, I
Device
S2
D
D
S2
D
= 6 A
= 8.5 A
D
= 5 A
Power33
= 7.2 A
T
C
= 25°C unless otherwise noted
Parameter
G
HS
®
V
IN
Power 33
Package
MOSFET
V
IN
Bottom
V
IN
V
G
IN
LS
T
T
T
T
T
1
A
A
A
C
C
GND
General Description
This device includes two specialized N-Channel MOSFETs in a
due power33(3mm X 3mm MLP) package. The switch node has
been internally connected to enable easy placement and routing
of synchronous buck converters. The control MOSFET (Q1) and
synchronous MOSFET (Q2) have been designed to provide
optimal power efficiency.
Applications
= 25 °C
= 25°C
= 25°C
= 25 °C
= 25 °C
Mobile Computing
Mobile Internet Devices
General Purpose Point of Load
GND
GND
Reel Size
13”
(Note 4)
(Note 3)
5
6
7
8
Tape Width
180
1.9
0.7
65
±20
6
12 mm
Q1
7.5
30
18
23
40
12
1a
1a
1a
1c
-55 to +150
1c
Q 2
125
8.5
2.5
1.0
50
±20
4.2
Q2
30
13
46
27
32
Q 1
1b
www.fairchildsemi.com
1b
1b
1d
1d
3000 units
March 2011
Quantity
4
3
2
1
Units
°C/W
°C
W
V
V
A

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FDMC8200S Summary of contents

Page 1

... Package Marking and Ordering Information Device Marking Device FDMC8200S FDMC8200S ©2011 Fairchild Semiconductor Corporation FDMC8200S Rev.C4 ® MOSFET General Description This device includes two specialized N-Channel MOSFETs in a due power33(3mm X 3mm MLP) package. The switch node has = 6 A been internally connected to enable easy placement and routing D of synchronous buck converters ...

Page 2

... Fall Time f Q Total Gate Charge g(TOT) Q Total Gate Charge g(TOT) Q Gate to Source Charge gs Q Gate to Drain “Miller” Charge gd ©2011 Fairchild Semiconductor Corporation FDMC8200S Rev. 25°C unless otherwise noted J Test Conditions = 250 μ 1mA 250 μA, referenced to 25°C I ...

Page 3

... Q1 mH Vgs = 10V, Vdd = 27V, 100% test mH Q2 100% test mH 3 N-ch device, the negative Vgs rating is for low duty cycle pulse ocurrence only. No continuous rating is implied. ©2011 Fairchild Semiconductor Corporation FDMC8200S Rev. 25°C unless otherwise noted J Test Conditions V ...

Page 4

... Figure 3. Normalized On Resistance vs Junction Temperature 40 μ PULSE DURATION = 80 s DUTY CYCLE = 0.5% MAX 150 2.0 2.5 3 GATE TO SOURCE VOLTAGE (V) GS Figure 5. Transfer Characteristics ©2011 Fairchild Semiconductor Corporation FDMC8200S Rev. 25°C unless otherwise noted μ s 2.0 2.5 3.0 100 50 75 100 125 150 0.01 ...

Page 5

... R = 125 C 180 C/W θ JA θ 0.01 0.001 0.01 0.1 1 0.01 0 DRAIN to SOURCE VOLTAGE ( DRAIN to SOURCE VOLTAGE (V) DS Figure 11. Forward Bias Safe Operating Area ©2011 Fairchild Semiconductor Corporation FDMC8200S Rev. 25°C unless otherwise noted J 1000 100 0 Figure 10. 100 100 us 100 100 100 ms ...

Page 6

... Typical Characteristics (Q1 N-Channel) 2 DUTY CYCLE-DESCENDING ORDER 0.5 0.2 0.1 0.05 0.1 0.02 0.01 SINGLE PULSE 0.01 R θ JA 0.003 - Figure 13. Junction-to-Ambient Transient Thermal Response Curve ©2011 Fairchild Semiconductor Corporation FDMC8200S Rev. 25°C unless otherwise noted 180 C RECTANGULAR PULSE DURATION (sec NOTES: DUTY FACTOR ...

Page 7

... PULSE DURATION = 80 s DUTY CYCLE = 0.5% MAX 150 1.0 1.5 2.0 2 GATE TO SOURCE VOLTAGE (V) GS Figure 18. Transfer Characteristics ©2011 Fairchild Semiconductor Corporation FDMC8200S Rev. °C unless otherwise noted μ s 1.0 1.5 Figure 15. Normalized on-Resistance vs Drain 100 100 125 150 0.1 ...

Page 8

... Figure 22. Unclamped Inductive Switching Capability THIS AREA IS LIMITED BY r DS(on) SINGLE PULSE 0 MAX RATED 125 C/W θ 0.01 0.01 0 DRAIN to SOURCE VOLTAGE (V) DS Figure 24. Forward Bias Safe Operating Area ©2011 Fairchild Semiconductor Corporation FDMC8200S Rev. 25°C unless otherwise noted 100 100 100 ...

Page 9

... Typical Characteristics (Q2 N-Channel) 2 DUTY CYCLE-DESCENDING ORDER 0.5 0.2 0.1 0.1 0.05 0.02 0.01 0.01 SINGLE PULSE R θ ( Note 1b 0.001 - Figure 26. Junction-to-Ambient Transient Thermal Response Curve ©2011 Fairchild Semiconductor Corporation FDMC8200S Rev. °C unless otherwise noted 125 C RECTANGULAR PULSE DURATION (sec NOTES: DUTY FACTOR ...

Page 10

... TIME (ns) Figure 27. FDMC8200S SyncFET body diode reverse recovery characteristic ©2011 Fairchild Semiconductor Corporation FDMC8200S Rev.C4 (continued) Schottky barrier diodes exhibit significant leakage at high tem- perature and high reverse voltage. This will increase the power in the device. 0.01 0.001 μ ...

Page 11

... Dimensional Outline and Pad Layout ©2011 Fairchild Semiconductor Corporation FDMC8200S Rev.C4 11 www.fairchildsemi.com ...

Page 12

... Datasheet Identification Product Status Advance Information Formative / In Design Preliminary First Production No Identification Needed Full Production Obsolete Not In Production ©2011 Fairchild Semiconductor Corporation FDMC8200S Rev.C4 Power-SPM™ ® PowerTrench SM PowerXS™ Programmable Active Droop™ ® QFET QS™ Quiet Series™ RapidConfigure™ ...

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