DSPIC33FJ32MC204-I/PT Microchip Technology Inc., DSPIC33FJ32MC204-I/PT Datasheet - Page 279

• Manufacturer Part Number: DSPIC33FJ32MC204-I/PT
• Description: 16-BIT DSC, 44LD, 32KB FLASH, MOTOR, 40 MIPS, NANOWATT
• Manufacturer: Microchip Technology Inc.
• Type: DSPr

Specifications of DSPIC33FJ32MC204-I/PT

• A/d Inputs: 9-Channels, 10-Bit
• Cpu Speed: 40 MIPS
• Eeprom Memory: 0 Bytes
• Input Output: 35
• Interface: I2C, SPI, UART/USART
• Ios: 35
• Memory Type: Flash
• Number Of Bits: 16
• Package Type: 44-pin TQFP
• Programmable Memory: 32K Bytes
• Ram Size: 2K Bytes
• Timers: 3-16-bit, 1-32-bit
• Voltage, Range: 3-3.6 V
• Dc: 08+
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

© 2007 Microchip Technology Inc.
28-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
N
1 2 3
b
D
Dimension Limits
e
Preliminary
A2
Units
E1
A2
A1
E1
L1
N
D
A
E
α
e
h
L
φ
c
b
β
α
E
2.05
0.10
0.25
0.40
0.18
0.31
MIN
φ
0°
5°
5°
–
L1
L
MILLMETERS
10.30 BSC
17.90 BSC
1.27 BSC
7.50 BSC
1.40 REF
h
NOM
28
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-052B
h
MAX
2.65
0.30
0.75
1.27
0.33
0.51
15°
15°
β
8°
–
DS70283B-page 277
c