PIC12F683-E/P Microchip Technology Inc., PIC12F683-E/P Datasheet - Page 138
![no-image](/images/manufacturer_photos/0/4/440/microchip_technology_inc__sml.jpg)
PIC12F683-E/P
Manufacturer Part Number
PIC12F683-E/P
Description
8 PIN, 3.5 KB FLASH, 128 RAM, 6 I/O, PDIP
Manufacturer
Microchip Technology Inc.
Datasheet
1.PIC12F683-EP.pdf
(148 pages)
Specifications of PIC12F683-E/P
A/d Inputs
4 Channel, 10-Bit
Comparators
1
Cpu Speed
5 MIPS
Eeprom Memory
256 Bytes
Frequency
20 MHz
Input Output
6
Memory Type
Flash
Number Of Bits
8
Package Type
8-pin PDIP
Programmable Memory
3.5K Bytes
Ram Size
128 Bytes
Serial Interface
None
Speed
20 MHz
Timers
2-8-bit, 1-16-bit
Voltage, Range
2-5.5 V
Lead Free Status / Rohs Status
RoHS Compliant part
Electrostatic Device
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PIC12F683
8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S) – Punch Singulated
DS41211B-page 136
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Base Thickness
Overall Length
Molded Package Length
Exposed Pad Length
Overall Width
Molded Package Width
Exposed Pad Width
Lead Width
Lead Length
Tie Bar Width
Mold Draft Angle Top
Drawing No. C04-113
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
JEDEC equivalent: Pending
A1
α
n
1
TOP VIEW
2
Dimension Limits
E1
E
Units
A2
E2
D2
A2
A3
E1
D1
A1
D1 D
E
D
B
R
n
p
A
L
α
A3
MIN
A
.000
.152
.085
.014
.020
Preliminary
.008 REF.
.050 BSC
.194 BSC
.184 BSC
.236 BSC
.226 BSC
INCHES
NOM
EXPOSED
.0004
.024
.014
.033
.026
.158
.016
.091
METAL
PADS
8
MAX
R
.002
.163
.097
.030
.039
.019
.031
12°
B
BOTTOM VIEW
MIN
0.00
3.85
2.16
0.35
0.50
E2
MILLIMETERS*
2004 Microchip Technology Inc.
0.20 REF.
1.27 BSC
4.92 BSC
4.67 BSC
5.99 BSC
5.74 BSC
p
NOM
4.00
0.40
0.60
.356
0.85
0.65
0.01
2.31
PIN 1
INDEX
L
8
D2
MAX
1.00
0.80
0.05
4.15
2.46
0.47
0.75
12°
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