DSPIC30F2020-30I/SP Microchip Technology Inc., DSPIC30F2020-30I/SP Datasheet - Page 272

• Manufacturer Part Number: DSPIC30F2020-30I/SP
• Description: DSP, 16-Bit, 12KB Flash, 512 RAM, 21 I/O, SDIP-28
• Manufacturer: Microchip Technology Inc.
• Type: DSPr

Specifications of DSPIC30F2020-30I/SP

• A/d Inputs: 8-Channels, 10-Bit
• Comparators: 4
• Cpu Speed: 30 MIPS
• Eeprom Memory: 0 Bytes
• Input Output: 21
• Interface: I2C/SPI/UART
• Ios: 21
• Memory Type: Flash
• Number Of Bits: 16
• Package Type: 28-pin SPDIP
• Programmable Memory: 12K Bytes
• Ram Size: 512 Bytes
• Timers: 3-16-bit, 1-32-bit
• Voltage, Range: 3-5.5
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

dsPIC30F1010/202X
28-Lead Plastic Small Outline (SO) – Wide, 300 mil Body (SOIC)
DS70178C-page 270
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-052
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
p
n
45
E1
E
Dimension Limits
h
§
Units
A2
A1
E1
A
E
D
B
n
p
h
L
c
2
1
D
L
MIN
Preliminary
.093
.088
.004
.394
.288
.695
.010
.016
.009
.014
0
0
0
A1
INCHES*
A
NOM
28
.050
.099
.008
.407
.295
.704
.020
.033
.017
.091
.011
12
12
4
MAX
.104
.094
.012
.420
.299
.712
.029
.050
.013
.020
15
15
8
MIN
17.65
10.01
2.36
2.24
0.10
7.32
0.25
0.23
0.36
0.41
0
0
0
MILLIMETERS
© 2006 Microchip Technology Inc.
NOM
28
10.34
17.87
1.27
2.50
0.20
7.49
0.50
0.84
0.28
0.42
2.31
12
12
4
MAX
A2
10.67
18.08
2.64
2.39
0.30
7.59
0.74
1.27
0.33
0.51
15
15
8