DSPIC30F3014-30I/P Microchip Technology Inc., DSPIC30F3014-30I/P Datasheet - Page 206

• Manufacturer Part Number: DSPIC30F3014-30I/P
• Description: DSP, 16-Bit, 24 KB Flash, 2KB RAM, 30 I/O, PDIP-40
• Manufacturer: Microchip Technology Inc.
• Type: DSPr

Specifications of DSPIC30F3014-30I/P

• A/d Inputs: 13-Channels, 12-Bit
• Cpu Speed: 30 MIPS
• Eeprom Memory: 1K Bytes
• Input Output: 30
• Interface: CAN, I2C, SPI, UART/USART
• Ios: 30
• Memory Type: Flash
• Number Of Bits: 16
• Package Type: 40-pin PDIP
• Programmable Memory: 24K Bytes
• Ram Size: 2K Bytes
• Timers: 3-16-bit, 1-32-bit
• Voltage, Range: 2.5-5.5
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

40-Lead Plastic Dual In-Line (P) – 600 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
dsPIC30F3014/4013
DS70138E-page 204
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
1 2 3
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
b
b1
D
Dimension Limits
Units
A2
A1
E1
eB
b1
N
D
e
A
E
L
b
c
e
A2
1.980
.125
.015
.590
.485
.008
.030
.014
MIN
.115
E1
–
–
L
.100 BSC
INCHES
NOM
40
Microchip Technology Drawing C04-016B
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–
–
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© 2007 Microchip Technology Inc.
eB
E
2.095
MAX
.250
.195
.625
.580
.200
.015
.070
.023
.700
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c