AD9858BSVZ Analog Devices Inc, AD9858BSVZ Datasheet - Page 6

• Manufacturer Part Number: AD9858BSVZ
• Description: IC DDS DAC 10BIT 1GSPS 100-TQFP
• Manufacturer: Analog Devices Inc

Specifications of AD9858BSVZ

• Design Resources: Low Jitter Sampling Clock Generator for High Performance ADCs Using AD9958/9858 and AD9515 (CN0109)
• Resolution (bits): 10 b
• Master Fclk: 1GHz
• Tuning Word Width (bits): 32 b
• Voltage - Supply: 3.14 V ~ 3.47 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 100-TQFP Exposed Pad, 100-eTQFP, 100-HTQFP, 100-VQFP
• Pll Type: Frequency Synthesis
• Frequency: 1GHz
• Supply Voltage Range: 3.135 To 3.165V, 4.75V To 5.25V
• Digital Ic Case Style: TQFP
• No. Of Pins: 100
• Operating Temperature Range: -40°C To +85°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AD9858/TLPCBZ - BOARD EVAL TRANSLATION LOOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

AD9858
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Maximum Junction Temperature
AV
DV
CPV
Digital Input Voltage Range
Digital Output Current
Storage Temperature Range
Operating Temperature Range
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL PERFORMANCE
Table 3.
Symbol
θ
θ
θ
θ
θ
Ψ
JA
JMA
JMA
JB
JC
JT
DD
DD
DD
Description (Using a 2S2P Test Board)
Junction-to-ambient thermal resistance,
0.0 m/sec airflow per JEDEC JESD51-2
(still air)
Junction-to-ambient thermal resistance,
1.0 m/sec airflow per JEDEC JESD51-6
(moving air)
Junction-to-ambient thermal resistance,
2.0 m/sec airflow per JEDEC JESD51-6
(moving air)
Junction-to-board thermal resistance,
1.0 m/sec airflow per JEDEC JESD51-8
(moving air)
Junction-to-case thermal resistance
(die to heat sink) per MIL-STD-883,
Method 1012.1
Junction-to-top-of-package
characterization parameter, 0 m/sec
airflow per JEDEC JESD51-2 (still air)
Rating
150°C
4 V
4 V
6 V
−0.7 V to +V
5 mA
−65°C to +150°C
−40°C to +85°C
DD
Value (°C/W)
19.8
15.6
14.6
8.2
0.6
0.15
Rev. C | Page 6 of 32
The AD9858 is specified for a case temperature (T
that T
To determine the junction temperature on the application
printed circuit board (PCB),
where:
T
T
the top center of package.
Ψ
PD is the power dissipation (see the total power dissipation in
Table 1).
Values of θ
PCB design considerations. θ
approximation of T
where T
Values of θ
design considerations (see Table 3).
Values of θ
design considerations when an external heat sink is required
(see Table 3).
EXPLANATION OF TEST LEVELS
I.
III.
IV.
V.
VI.
ESD CAUTION
J
CASE
JT
is the junction temperature (°C).
is found in Table 3.
T
T
is the case temperature (°C) measured by the customer at
CASE
100% production tested.
Sample tested only.
Parameter is guaranteed by design and characterization
testing.
Parameter is a typical value only.
Devices are 100% production tested at 25°C and guaranteed
by design and characterization testing for industrial
operating temperature range.
J
J
= T
= T
A
is the ambient temperature (°C).
is not exceeded, an airflow source may be used.
CASE
A
JA
JB
JC
+ (θ
are provided for package comparison and
are provided for package comparison and PCB
are provided for package comparison and PCB
+ (Ψ
JA
× PD)
J
JT
by the equation
× PD)
JA
can be used for a first-order
CASE
). To ensure