PCX755BVZFU300LE Atmel, PCX755BVZFU300LE Datasheet - Page 45

• Manufacturer Part Number: PCX755BVZFU300LE
• Description: IC MPU 32BIT 300MHZ 360PBGA
• Manufacturer: Atmel

Specifications of PCX755BVZFU300LE

• Processor Type: PowerPC 32-Bit RISC
• Speed: 300MHz
• Voltage: 2V
• Mounting Type: Surface Mount
• Package / Case: 360-PBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

11. Package Mechanical Data
11.1
2138G–HIREL–05/06
Package Parameters for the PC745
The following sections provide the package parameters and mechanical dimensions for the
PC745, 255 PBGA package as well as the PC755, 360 CBGA and PBGA packages. While both
the PC755 plastic and the ceramic packages are described here, both packages are not guaran-
teed to be available at the same time. All new designs should allow for either ceramic or plastic
BGA packages for this device. For more information on designing a common footprint for both
plastic and ceramic package types, please contact your local Atmel sales office.
The package parameters are as provided in the following list. The package type is 21 × 21 mm,
255-lead plastic ball grid array (PBGA).
Table 11-1.
Parameter
Package outline
Interconnects
Pitch
Minimum module height
Maximum module height
Ball diameter (typical)
Package Parameters
HiTCE
21 × 21 mm
255 (16 × 16 ball array – 1)
1.27 mm (50 mil)
2.42
3.08
0.89 mm (35 mil)
PBGA
21 × 21 mm
255 (16 × 16 ball array – 1)
1.27 mm (50 mil)
2.25 mm
2.80 mm
0.75 mm (29.5 mil)
PC755/745
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