MC68360CAI25L Freescale Semiconductor, MC68360CAI25L Datasheet - Page 175

IC MPU QUICC 25MHZ 240-FQFP

MC68360CAI25L

Manufacturer Part Number
MC68360CAI25L
Description
IC MPU QUICC 25MHZ 240-FQFP
Manufacturer
Freescale Semiconductor

Specifications of MC68360CAI25L

Processor Type
M683xx 32-Bit
Speed
25MHz
Voltage
5V
Mounting Type
Surface Mount
Package / Case
240-FQFP
Family Name
M68000
Device Core
ColdFire
Device Core Size
32b
Frequency (max)
25MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
5V
Operating Supply Voltage (max)
5.25V
Operating Supply Voltage (min)
4.75V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
240
Package Type
FQFP
Controller Family/series
68K
Core Size
32 Bit
Cpu Speed
25MHz
No. Of Timers
4
Embedded Interface Type
SCP, TDM
Digital Ic Case Style
FQFP
Supply Voltage Range
3V To 3.6V, 4.75V To 5.25V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Compliant

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Manufacturer:
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Rounding yields:
The second result is preferred. The following code sequence illustrates how addition of a
series of table interpolations can be performed without loss of precision in the intermediate
results:
5.3.4.5 TABLE EXAMPLE 5: SURFACE INTERPOLATIONS. The various forms of table
can be used to perform surface (3D) TBLs. However, since the calculation must be split into
a series of 2D TBLs, it is possible to lose precision in the intermediate results. The following
code sequence, incorporating both TBLS and TBLSN, eliminates this possibility.
Before execution of this code sequence, Dx must contain fraction and entry numbers for the
two TBL, and Dm must contain the fraction for surface interpolation. The ea fields in the
TBLSN instructions point to consecutive columns in a 3D table. The TBLS size parameter
must be word if the TBLSN size parameter is byte, and must be long word if TBLSN is word.
Increased size is necessary because a larger number of significant digits is needed to
accommodate the scaled fractional results of the 2D TBL.
5.3.5 Nested Subroutine Calls
The LINK instruction pushes an address onto the stack, saves the stack address at which
the address is stored, and reserves an area of the stack for use. Using this instruction in a
series of subroutine calls will generate a linked list of stack frames.
L0:
TBLSN.B
TBLSN.B
TBLSN.B
ADD.L
ADD.L
ASR.L
BCC.B
ADDQ.B
L1: . . .
L0:
MOVE.W
TBLSN.B
TBLSN.B
TBLS.W
ASR.L
BCC.B
ADDQ.B
L1: . . .
Dx, Dm
Dm, Dl
#8, Dl
L1
#1, Dl
Dx, Dl
Dx:Dl, Dm
#8, Dm
L1
#1, Dl
ea Dx
ea Dx
ea Dl
ea , Dx
ea Dl
Freescale Semiconductor, Inc.
For More Information On This Product,
Long addition avoids problems with carry
Move radix point
Fraction MSB in carry
MC68360 USER’S MANUAL
Copy entry number and fraction number
Surface interpolation, with round
Read just the result
No round necessary
Half round up
Go to: www.freescale.com
0010 0000 . 0111 0000
0011 1111 . 0111 0000
0000 0001 . 0111 0000
0110 0001 . 0101 0000
0110 0001 .
CPU32+

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