MPC8360EZUAJDGA Freescale Semiconductor, MPC8360EZUAJDGA Datasheet - Page 69
MPC8360EZUAJDGA
Manufacturer Part Number
MPC8360EZUAJDGA
Description
IC MPU POWERQUICC II PRO 740TBGA
Manufacturer
Freescale Semiconductor
Datasheet
1.MPC8360CZUAJDG.pdf
(108 pages)
Specifications of MPC8360EZUAJDGA
Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
533MHz
Voltage
1.2V
Mounting Type
Surface Mount
Package / Case
740-TBGA
Processor Series
MPC8xxx
Core
e300
Data Bus Width
32 bit
Development Tools By Supplier
MPC8360E-RDK
Maximum Clock Frequency
533 MHz
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
I/o Voltage
1.8 V, 2.5 V, 3.3 V
Minimum Operating Temperature
0 C
For Use With
MPC8360EA-MDS-PB - KIT APPLICATION DEV 8360 SYSTEMMPC8360E-RDK - BOARD REFERENCE DESIGN FOR MPC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC8360EZUAJDGA
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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Package and Pin Listings
21.2
Mechanical Dimensions of the TBGA Package
Figure 53
depicts the mechanical dimensions and bottom surface nomenclature of the device, 740-TBGA
package.
Figure 53. Mechanical Dimensions and Bottom Surface Nomenclature of the TBGA Package
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 4
Freescale Semiconductor
69
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