XC4VFX12-10FFG668C Xilinx Inc, XC4VFX12-10FFG668C Datasheet - Page 208

• Manufacturer Part Number: XC4VFX12-10FFG668C
• Description: IC FPGA VIRTEX-4 FX 12K 668FCBGA
• Manufacturer: Xilinx Inc
• Series: Virtex™-4r

Specifications of XC4VFX12-10FFG668C

• Total Ram Bits: 663552
• Number Of Logic Elements/cells: 12312
• Number Of Labs/clbs: 1368
• Number Of I /o: 320
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C
• Package / Case: 668-BBGA, FCBGA
• No. Of Logic Blocks: 12312
• No. Of Macrocells: 12312
• No. Of Speed Grades: 10
• No. Of I/o's: 320
• Clock Management: DCM
• I/o Supply Voltage: 3.45V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: HW-V4-ML403-UNI-G - EVALUATION PLATFORM VIRTEX-4HW-AFX-FF668-400 - BOARD DEV VIRTEX 4 FF668
• Number Of Gates: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 122-1591; XC4VFX12-10FFG668C

Chapter 5: Configurable Logic Blocks (CLBs)
208
Slice Distributed RAM Timing Model and Parameters
(Available in SLICEM only)
Figure 5-22
slice. Some elements of the Virtex-4 FPGA slice are omitted for clarity. Only the elements
relevant to the timing paths described in this section are shown.
FXINA
FXINB
CLK
BY
DATA_IN or
Address
BX
DATA_IN or
Address
(Write Enable)
SLICEWE[1:0]
SR
G4
G3
G2
G1
ADDRESS
ADDRESS
F4
F3
F2
F1
Figure 5-22: Simplified Virtex-4 FPGA SLICEM Distributed RAM
illustrates the details of distributed RAM implemented in a Virtex-4 FPGA
WSGEN
WE
CK
www.xilinx.com
WS
WS
RAM
RAM
D
D
DI
DI
COUT
MUXF5
MUXFX
UG070 (v2.6) December 1, 2008
Virtex-4 FPGA User Guide
UG070_5_22_071504
FX
YMUX
Y
F5
XMUX
X
R