MCC501RX200TD0B Freescale Semiconductor, MCC501RX200TD0B Datasheet - Page 94
MCC501RX200TD0B
Manufacturer Part Number
MCC501RX200TD0B
Description
Manufacturer
Freescale Semiconductor
Datasheet
1.MCC501RX200TD0B.pdf
(100 pages)
Specifications of MCC501RX200TD0B
Package Type
BGA
Mounting
Surface Mount
Operating Temperature (min)
-40C
Operating Temperature Classification
Industrial
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCC501RX200TD0B
Manufacturer:
FREESCALE
Quantity:
20 000
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96
C5NP
CHAPTER 4: MECHANICAL SPECIFICATIONS
3 A nitrogen atmosphere is not required, but will make the process more robust. It can
4 Full convection forced air furnaces work best, but IR, Convection/IR, or vapor phase can
make a difference for marginally solderable PC board pads.
be used.
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