MCC501RX200TD0B Freescale Semiconductor, MCC501RX200TD0B Datasheet - Page 91

• Manufacturer Part Number: MCC501RX200TD0B
• Manufacturer: Freescale Semiconductor

Specifications of MCC501RX200TD0B

• Package Type: BGA
• Mounting: Surface Mount
• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Not Compliant

Package Views
Chapter 4
The C-5 network processor is an 838 pin (29 pins x 29 pins) Ball Grid Array (BGA) package
as shown in the following illustrations.
Figure 26 C-5 Network Processor BGA Package Side View
HiTCE: Green ceramic is thermally matched to FR4 circuit board.
The aluminum lid is electrically connected to the grounded substrate of the C-5 NP.
Neither the lid nor any heat sink connected to the lid should be part of a current-carrying
path. It is acceptable, however, to connect the lid or heatsink to ground if necessary
(through the standoff screws for the heat sink).
MECHANICAL SPECIFICATIONS
Table 57
defines the package measurements.
C5NPD0-DS/D
Rev 04
V 04