MCC501RX200TD0B Freescale Semiconductor, MCC501RX200TD0B Datasheet - Page 84

• Manufacturer Part Number: MCC501RX200TD0B
• Manufacturer: Freescale Semiconductor

Specifications of MCC501RX200TD0B

• Package Type: BGA
• Mounting: Surface Mount
• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Not Compliant

84
C5NP
CHAPTER 3: ELECTRICAL SPECIFICATIONS
Table 48 Low Speed Serial Interface Timing Description (continued) (continued)
PROM Interface Timing Specifications
The PROM interface timing is shown in
Figure 21 PROM Interface Timing Diagram
Table 49 PROM Interface Timing Description
*
SYMBOL
Tbuf
Cmax
SYMBOL
Tspc
Tspis
Tspih
Tsplo
Tspdo
Tsc is the System Cycle Time. See
PARAMETER
Bus Free Time Between a STOP and START Condition
Capacitive load for each line of the bus
PARAMETER
SPCK Cycle Time
SPDI Setup
SPDI Hold
SPLD Output
SPDO Output
CLOCK MODE
Table 39
1X
2X
1X
2X
on page 74
Figure 21
MIN
40.0
10.0
0.0
Tsc*
2 x Tsc*
Tsc*
2 x Tsc*
and described in
TYP
MIN
1250
MAX
Tsc + 3.0
2 x Tsc + 3.0
Tsc + 3.0
2 x Tsc + 3.0
Table
49.
MAX
400
UNIT
ns
ns
ns
ns
ns
ns
ns
UNIT
ns
pF