ANXL1500FGC3M AMD (ADVANCED MICRO DEVICES), ANXL1500FGC3M Datasheet - Page 63

• Manufacturer Part Number: ANXL1500FGC3M
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of ANXL1500FGC3M

• Lead Free Status / Rohs Status: Supplier Unconfirmed

Mechanical Data
The AMD Geode™ NX processor connects to the mother-
board through a Pin Grid Array (PGA) socket named
Socket A. This processor utilizes the organic pin grid array
(OPGA) package type described in this chapter. For more
information, see the AMD Athlon™ Processor-Based Moth-
erboard Design Guide (publication ID 24363).
6.1
The processor die on the OPGA package is exposed at the
top of the package. This feature facilitates heat transfer
from the die to an approved heat sink. Any heat sink design
should avoid loads on corners and edges of die. The
OPGA package has compliant pads that serve to bring sur-
faces in planar contact. Tool-assisted zero insertion force
sockets should be designed so that no load is placed on
the substrate of the package.
Table 6-1 shows the mechanical loading specifications for
the processor die. It is critical that the mechanical loading
of the heat sink does not exceed the limits shown in Table
6-1.
Note 1.
Note 2.
AMD Geode™ NX Processors Data Book
Letter or Symbol
D1/E1
D/E
D2
D3
D4
D5
D6
D7
D8
D9
E2
E3
E4
E5
E6
E8
E9
Dimensions are given in millimeters.
The mass consists of the completed package, including processor, surface mounted parts, and pins.
Die Loading
Min Dimension
(Note 1)
49.27
10.78
10.78
12.33
12.71
10.73
13.28
3.30
8.13
3.05
2.35
7.87
7.87
1.66
Table 6-2. 28104 OPGA Package Dimensions
45.72 BSC
11.33 REF
7.47 REF
Max Dimension
(Note 1)
49.78
11.33
11.33
12.88
13.26
11.28
13.83
3.60
8.68
3.35
2.65
8.42
8.42
1.96
Note 1. Load specified for coplanar contact to die surface.
Note 2. Load defined for a surface at no more than a two-
6.2
Table 6-2 shows the part number 28104 OPGA package
dimensions in millimeters assigned to the letters and sym-
bols used in the package diagram, Figure 6-1 on page 64.
Letter or Symbol
Location
Die Surface (Note 1)
Die Edge (Note 2)
Mass (Note 2)
6.0Mechanical Data
G/H
φb1
A1
A2
A3
A4
φP
φb
e1
M
N
A
S
L
e
degree angle of inclination to die surface.
OPGA Package Descriptions
Table 6-1. Mechanical Loading
Min Dimension
(Note 1)
0.977
0.116
1.435
Dynamic
0.80
0.43
3.05
31177H
–
–
–
(Max)
100
10
11.0 g REF
1.917 REF
1.27 BSC
2.54 BSC
1.40 REF
453
37
Static
(Max)
Max Dimension
6
30
10
(Note 1)
1.177
2.375
4.50
0.88
1.90
6.60
0.50
3.31
–
Units
lbf
lbf
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