AD9271BSVZRL-25 Analog Devices Inc, AD9271BSVZRL-25 Datasheet - Page 10

• Manufacturer Part Number: AD9271BSVZRL-25
• Description: IC ADC OCT 12BIT 25MSPS 100-TQFP
• Manufacturer: Analog Devices Inc

Specifications of AD9271BSVZRL-25

• Number Of Bits: 12
• Sampling Rate (per Second): 25M
• Data Interface: Serial, SPI™
• Number Of Converters: 8
• Power Dissipation (max): 1.06W
• Voltage Supply Source: Single Supply
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 100-TQFP Exposed Pad
• Power Dissipation Pd: 150mW
• Peak Reflow Compatible (260 C): Yes
• Supply Voltage: 1.8V
• Sample Rate: 25 MSPS
• Termination Type: SMD
• Supply Voltage Max: 1.9V
• Input Channels Per Adc: 8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AD9271-50EBZ - BOARD EVALUATION AD9271 50MSPS
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

AD9271
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
ELECTRICAL
ENVIRONMENTAL
AVDD
DRVDD
CWVDD
GND
AVDD
Digital Outputs
CLK+, CLK−
LI-x
LO-x
LOSW-x
CWDx−, CWDx+
SDIO, GAIN+, GAIN−
PDWN, STBY, SCLK, CSB
REFT, REFB, RBIAS
VREF, SENSE
Operating Temperature
Storage Temperature
Maximum Junction
Lead Temperature
(DOUTx+, DOUTx−,
DCO+, DCO−,
FCO+, FCO−)
Range (Ambient)
Range (Ambient)
Temperature
(Soldering, 10 sec)
With
Respect To
GND
GND
GND
GND
DRVDD
GND
GND
LG-x
LG-x
LG-x
GND
GND
GND
GND
GND
−0.3 V to +3.9 V
Rating
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +0.3 V
−2.0 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−40°C to +85°C
−65°C to +150°C
150°C
300°C
Rev. B | Page 10 of 60
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL IMPEDANCE
Table 5.
Air Flow Velocity (m/s)
0.0
1.0
2.5
1
ESD CAUTION
θ
soldered to PCB.
JA
for a 4-layer PCB with solid ground plane (simulated). Exposed pad
θ
20.3
14.4
12.9
JA
1
θ
7.6
JB
θ
4.7
JC
Unit
°C/W
°C/W
°C/W