ML610Q422-NNNTBZ03A7 Rohm Semiconductor, ML610Q422-NNNTBZ03A7 Datasheet - Page 92

• Manufacturer Part Number: ML610Q422-NNNTBZ03A7
• Description: MCU 8BIT 32K FLASH 22CH 120-TQFP
• Manufacturer: Rohm Semiconductor
• Series: -r

Specifications of ML610Q422-NNNTBZ03A7

• Core Processor: nX-U8/100
• Core Size: 8-Bit
• Speed: 4.2MHz
• Connectivity: I²C, SSP, UART/USART
• Peripherals: LCD, Melody Driver, POR, PWM, WDT
• Number Of I /o: 14
• Program Memory Size: 32KB (16K x 16)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 1.1 V ~ 3.6 V
• Data Converters: A/D 2x12b, 2x24b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 70°C
• Package / Case: 100-TFQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

6.3
6.3.1
6.3.1.1
Figure 6-2 shows the configuration of the low-speed clock generation circuit.
A low-speed clock generation circuit is provided with an external 32.768 kHz crystal. To match the oscillation frequency
by using a trimmer capacitor, connect external capacitors (C
In STOP mode, V
Impedance state).
When the ENMLT bit of FCON1 is set to “1”, the 2× low-speed clock circuit starts to generate the LSCLK×2(64kHz)
Notes:
− Install a crystal as close to the LSI as possible and make sure that signals causing noise and power supply wiring are
− Note that oscillation may stop due to condensation.
not near the crystal and its wiring.
Description of Operation
Low-Speed Clock
V
Low-Speed Clock Generation Circuit
C
SS
32.768 kHz
GL
crystal
C
Figure 6-2 Circuit Configuration of 32.768 kHz Crystal Oscillation Mode
DDX
DL
is powered off to stop low-speed oscillation, and the XT0 and XT1 pins become Hiz (Hi
XT1
XT 0
V
SS
V
SS
C
C
G
V
D
DDX
R
Control Circuit
F
6 – 6
GL
and C
DL
) as required.
ML610Q421/ML610Q422 User’s Manual
2× clock
circuit
Chapter 6 Clock Generation Circuit
STOP mode
Low-speed clock
(LSCLK)
2× low-speed clock
(LSCLK×2)
ENMLT