PIC16F1526T-I/PT Microchip Technology, PIC16F1526T-I/PT Datasheet - Page 314

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PIC16F1526T-I/PT

Manufacturer Part Number
PIC16F1526T-I/PT
Description
64-pin, 14KB Flash, 768B RAM, 10-bit ADC, 10xCCP, 2xSPI, 2xMI2C, 2xEUSART, 2.3V-
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Datasheet

Specifications of PIC16F1526T-I/PT

Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
54
Program Memory Size
14KB (8K x 14)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
2.3 V ~ 5.5 V
Data Converters
A/D 30x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F1526T-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC16F1526T-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC16(L)F1526/27
25.6
DS41458B-page 314
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  T
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Legend:
Note 1: I
Param
No.
2: T
3: T
Thermal Considerations
P
DD
INTERNAL
A
J
T
Sym.
P
TBD = To Be Determined
P
= Junction Temperature.
JMAX
= Ambient Temperature.
PD
DER
is current to run the chip alone without driving any load on the output pins.
JA
JC
I
/
O
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Case
Maximum Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
A
Characteristic
 +125°C
Preliminary
Typ.
TBD
TBD
TBD
TBD
150
Units
 C/W
 C/W
 C/W
 C/W
 C
W
W
W
W
PD = P
P
64-pin TQFP package
64-pin QFN package
64-pin TQFP package
64-pin QFN package
P
P
INTERNAL
I
DER
/
O
=  (I
= PD
INTERNAL
 2011 Microchip Technology Inc.
OL
= I
MAX
* V
DD
Conditions
(T
OL
+ P
x V
J
) +  (I
- T
DD (1)
I
/
O
A
)/ 
OH
JA (2)
* (V
DD
- V
OH
))

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