TDA9885TS/V3 NXP Semiconductors, TDA9885TS/V3 Datasheet - Page 56

• Manufacturer Part Number: TDA9885TS/V3
• Description: Modulator / Demodulator ALIGN FRRE VIF/SIF CIR NEG MOD
• Manufacturer: NXP Semiconductors

Specifications of TDA9885TS/V3

• Package / Case: SSOP-24
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: - 20 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: TDA9885TS/V3,112

NXP Semiconductors
21. Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
8.10
8.11
8.12
8.13
8.14
8.15
8.16
9
9.1
9.1.1
9.1.2
9.2
9.2.1
9.2.2
9.2.3
9.2.4
10
11
12
13
14
15
16
16.1
16.2
16.3
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 4
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pinning information . . . . . . . . . . . . . . . . . . . . . . 6
Functional description . . . . . . . . . . . . . . . . . . . 8
I
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 21
Thermal characteristics. . . . . . . . . . . . . . . . . . 21
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 22
Application information. . . . . . . . . . . . . . . . . . 45
Test information . . . . . . . . . . . . . . . . . . . . . . . . 46
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 48
Soldering of SMD packages . . . . . . . . . . . . . . 51
2
C-bus control . . . . . . . . . . . . . . . . . . . . . . . . . 14
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 7
VIF amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Tuner AGC and VIF AGC . . . . . . . . . . . . . . . . . 8
VIF-AGC detector . . . . . . . . . . . . . . . . . . . . . . . 9
FPLL detector . . . . . . . . . . . . . . . . . . . . . . . . . . 9
VCO and divider . . . . . . . . . . . . . . . . . . . . . . . . 9
AFC and digital acquisition help . . . . . . . . . . . 10
Video demodulator and amplifier . . . . . . . . . . 10
Sound carrier trap . . . . . . . . . . . . . . . . . . . . . . 11
SIF amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . 11
SIF-AGC detector . . . . . . . . . . . . . . . . . . . . . . 11
Single reference QSS mixer . . . . . . . . . . . . . . 11
AM demodulator . . . . . . . . . . . . . . . . . . . . . . . 12
FM demodulator and acquisition help. . . . . . . 12
Audio amplifier and mute time constant . . . . . 12
Internal voltage stabilizer . . . . . . . . . . . . . . . . 13
I
Read format . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Slave address . . . . . . . . . . . . . . . . . . . . . . . . . 14
Data byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Write format . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Subaddress (A data). . . . . . . . . . . . . . . . . . . . 17
Data byte for switching mode (B data) . . . . . . 17
Data byte for adjust mode (C data). . . . . . . . . 18
Data byte for data mode (E data) . . . . . . . . . . 19
Introduction to soldering . . . . . . . . . . . . . . . . . 51
Wave and reflow soldering . . . . . . . . . . . . . . . 51
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 51
2
C-bus transceiver and MAD . . . . . . . . . . . . . 13
I
2
C-bus controlled multistandard alignment-free IF-PLL demodulators
16.4
17
18
19
19.1
19.2
19.3
19.4
20
21
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 53
Revision history . . . . . . . . . . . . . . . . . . . . . . . 54
Legal information . . . . . . . . . . . . . . . . . . . . . . 55
Contact information . . . . . . . . . . . . . . . . . . . . 55
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 52
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 55
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 55
TDA9885; TDA9886
Document identifier: TDA9885_TDA9886_3
Date of release: 16 December 2008
All rights reserved.