BGA 777L7 E6327 Infineon Technologies, BGA 777L7 E6327 Datasheet - Page 22

• Manufacturer Part Number: BGA 777L7 E6327
• Description: RF Amplifier RF SILICON MMIC
• Manufacturer: Infineon Technologies
• Type: Low Power Single Bandr

Specifications of BGA 777L7 E6327

• Operating Frequency: 2650 MHz
• P1db: 4 dBm
• Noise Figure: 1.2 dB
• Operating Supply Voltage: 2.8 V
• Supply Current: 10 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: TSLP-7-1
• Minimum Operating Temperature: - 30 C
• Other names: BGA777L7E6327XT

4
4.1
Figure 8
Figure 9
Figure 10
Data Sheet
0.3
Copper
Physical Characteristics
Package Dimensions
Recommended footprint and stencil layout for the TSLP-7-1 package
Package outline (top, side and bottom view)
Tape & reel dimensions
1.4
0.3
Solder mask
0.3
Pin 1 marking
1) Dimension applies to plated terminal
N SM D
Top view
0.25
Stencil apertures
0.25
Pin 1
marking
1.4
0.05 MAX.
0.4
1.45
R0.1
BGA777L7 - Low Power Single-Band UMTS LNA
+0.1
4
22
7
0.3
Copper
TSLP-7-1-TP V03
3
4
Bottom view
1.2
6 x 0.2
1.3
1
0.5
1.4
0.3
±0.05
±0.035
2
±0.05
5
±0.035 1)
Solder mask
1)
6
0.3
1
TSLP-7-1-PO V04
SMD
Physical Characteristics
0.25
Stencil apertures
Package Dimensions
0.25
V3.0, 2009-07-02
1.4
TSLP-7-1-FP V01
R0.1