BGA 777L7 E6327 Infineon Technologies, BGA 777L7 E6327 Datasheet - Page 17

• Manufacturer Part Number: BGA 777L7 E6327
• Description: RF Amplifier RF SILICON MMIC
• Manufacturer: Infineon Technologies
• Type: Low Power Single Bandr

Specifications of BGA 777L7 E6327

• Operating Frequency: 2650 MHz
• P1db: 4 dBm
• Noise Figure: 1.2 dB
• Operating Supply Voltage: 2.8 V
• Supply Current: 10 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: TSLP-7-1
• Minimum Operating Temperature: - 30 C
• Other names: BGA777L7E6327XT

3
3.1
Figure 2
Note: Package paddle (Pin 0) has to be RF grounded.
Table 10
Part Number
L1 ... L3
C1 ... C3
RREF
Data Sheet
2600 MHz
V
V
EN
GS
= 0 / 2.8 V
= 0 / 2.8 V
RFIN
3.3nH
Application Circuit and Block Diagram
UMTS Band 7 Application Circuit Schematic
Application circuit with chip outline (top view)
Parts List
L1
3.9nH
L2
Part Type
Chip inductor
Chip capacitor
Chip resistor
2.4pF
C1
RFIN
VEN
VGS
1
2
3
Biasing & Logic
Circuitry
Manufacturer
Various
Various
Various
BGA777L7 - Low Power Single-Band UMTS LNA
17
7 GND
BGA777L7_Appl _Band7_BlD.vsd
UMTS Band 7 Application Circuit Schematic
Size
0402
0402
0402
Application Circuit and Block Diagram
RFOUT
RREF
VCC
6
5
4
3.3nH
Comment
Wirewound, Q ≈ 50
L3
10nF
8.2kΩ
R
C3
REF
V3.0, 2009-07-02
V
CC
1.5pF
= 2.8 V
C2
RFOUT
2600 MHz