MT48H16M16LFBF-75:H TR Micron Technology Inc, MT48H16M16LFBF-75:H TR Datasheet - Page 2

• Manufacturer Part Number: MT48H16M16LFBF-75:H TR
• Description: DRAM Chip Mobile SDRAM 256M-Bit 16Mx16 1.8V 54-Pin VFBGA T/R
• Manufacturer: Micron Technology Inc
• Type: Mobile SDRAMr

Specifications of MT48H16M16LFBF-75:H TR

• Package: 54VFBGA
• Density: 256 Mb
• Address Bus Width: 15 Bit
• Operating Supply Voltage: 1.8 V
• Maximum Clock Rate: 133 MHz
• Maximum Random Access Time: 8|6 ns
• Operating Temperature: 0 to 70 °C

Figure 1: 256Mb Mobile LPSDR Part Numbering
FBGA Part Marking Decoder
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. Micron’s FBGA part marking decoder is available at www.micron.com/decoder.
PDF: 09005aef834c13d2
256mb_mobile_sdram_y36n.pdf - Rev. I 11/09 EN
Micron Technology
Product Family
48 = Mobile SDR SDRAM
Operating Voltage
H = 1.8V/1.8V
Configuration
16 Meg x 16
8 Meg x 32
Addressing
LF = Mobile standard addressing
MT
48
H 16M16 LF
256Mb: 16 Meg x 16, 8 Meg x 32 Mobile SDRAM
2
BF
-6
Micron Technology, Inc. reserves the right to change products or specifications without notice.
IT
:H
Revision
:H
Operating Temperature
Blank = Commercial (0°C to +70°C)
IT = Industrial (–40°C to +85°C)
Cycle Time
-75 = 7.5ns
Package Codes
BF = 8mm x 9mm VFBGA “green”
B5 = 8mm x 13mm VFBGA “green”
-6 = 6ns
t
CK, CL = 3
t
©2008 Micron Technology, Inc. All rights reserved.
CK, CL = 3
Features