MT47H256M8EB-25E:C Micron Technology Inc, MT47H256M8EB-25E:C Datasheet - Page 19
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MT47H256M8EB-25E:C
Manufacturer Part Number
MT47H256M8EB-25E:C
Description
256MX8 DDR2 SDRAM PLASTIC GREEN FBGA 1.8V
Manufacturer
Micron Technology Inc
Series
-r
Datasheet
1.MT47H256M8EB-25EC.pdf
(134 pages)
Specifications of MT47H256M8EB-25E:C
Format - Memory
RAM
Memory Type
DDR2 SDRAM
Memory Size
2G (256M x 8)
Speed
2.5ns
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
0°C ~ 85°C
Package / Case
60-TFBGA
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT47H256M8EB-25E:C
Manufacturer:
ATT
Quantity:
400
Company:
Part Number:
MT47H256M8EB-25E:C
Manufacturer:
MICRON
Quantity:
12 208
Company:
Part Number:
MT47H256M8EB-25E:C
Manufacturer:
MICRON
Quantity:
12 208
Company:
Part Number:
MT47H256M8EB-25E:C
Manufacturer:
BGA
Quantity:
11 350
Company:
Part Number:
MT47H256M8EB-25E:C
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT47H256M8EB-25E:C
Manufacturer:
MICRON
Quantity:
20 000
Packaging
Package Dimensions
Figure 8: 84-Ball FBGA Package (11.5mm x 14mm) – x16
PDF: 09005aef824f87b6
2gbddr2.pdf – Rev. E 06/10 EN
Seating
11.2 CTR
Solder ball
material: SAC305.
Dimensions apply
to solder balls post-
reflow on Ø0.33
NSMD ball
pads.
plane
0.12
84X Ø0.45
0.8 TYP
A
A
Notes:
9 8 7
1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu).
11.5 ±0.15
0.8 TYP
6.4 CTR
3 2 1
0.8 ±0.1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
Ball A1 ID
14 ±0.15
19
Micron Technology, Inc. reserves the right to change products or specifications without notice.
0.25 MIN
2Gb: x4, x8, x16 DDR2 SDRAM
1.2 MAX
Ball A1 ID
© 2006 Micron Technology, Inc. All rights reserved.
Packaging