BLF6G10LS-135R,112 NXP Semiconductors, BLF6G10LS-135R,112 Datasheet - Page 4

IC BASESTATION FINAL SOT502B

BLF6G10LS-135R,112

Manufacturer Part Number
BLF6G10LS-135R,112
Description
IC BASESTATION FINAL SOT502B
Manufacturer
NXP Semiconductors

Specifications of BLF6G10LS-135R,112

Package / Case
SOT502B
Transistor Type
LDMOS
Frequency
871.5MHz
Gain
21dB
Voltage - Rated
65V
Current Rating
32A
Current - Test
950mA
Voltage - Test
28V
Power - Output
26.5W
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
0.1 Ohms
Drain-source Breakdown Voltage
65 V
Gate-source Breakdown Voltage
13 V
Continuous Drain Current
32 A
Maximum Operating Temperature
+ 225 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 65 C
Channel Type
N
Channel Mode
Enhancement
Drain Source Voltage (max)
65V
Output Power (max)
26.5W(Typ)
Power Gain (typ)@vds
21@28VdB
Frequency (min)
869MHz
Frequency (max)
894MHz
Package Type
LDMOST
Pin Count
3
Forward Transconductance (typ)
13S
Drain Source Resistance (max)
100(Typ)@6.15Vmohm
Reverse Capacitance (typ)
2@28VpF
Operating Temp Range
-65C to 225C
Drain Efficiency (typ)
28%
Mounting
Surface Mount
Mode Of Operation
2-Carrier W-CDMA
Number Of Elements
1
Vswr (max)
10
Screening Level
Military
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Noise Figure
-
Lead Free Status / Rohs Status
Compliant
Other names
934061247112
BLF6G10LS-135R
BLF6G10LS-135R
4
Highlights of the NXP product portfolio
Media processors
Video encoders / decoders
Audio DACs and CODECs
USB, serial-protocol bridges,
and 1394
Wireless connectivity
Audio amplifiers
I
2
C-bus devices
Advanced, highly integrated processors for streaming audio and video, graphics, and
control. Options include LCD and Ethernet interfaces, HD video, MPEG-2 encoding, and
scaling software for LCD TV. Special versions for portable applications are also available.
Multi-standard video products made to interface with popular bus architectures, such as
PCI and PCI Express. Includes standalone 9-bit video decoders and encoders.
Dual-channel stereo audio DACs for low-power applications and IEC958 audio, plus dual-
and multichannel stereo audio CODECs with options for SSA audio, low-voltage operation,
DSP features, and SPDIF interfaces.
A comprehensive array of USB devices (including Hi-Speed USB and USB OTG
functionality), a series of serial-protocol bridges that bring UARTs, I
interfaces together onto a single chip, and solutions for 1394.
Highly integrated modules for low-power Wi-Fi
seamless co-existence, plus receiver and transmitter ICs for Near Field Communication
(NFC), the wireless technology, co-created by NXP, that initiates a peer-to- peer connection
by simply bringing two devices close to each other.
An extensive array of high-efficiency amplifiers, including Class-D amplifiers, in a range
of power ratings for a wide variety of applications, from high-end home entertainment
systems and TVs to low-power headphones and speakers for multimedia PCs and portable
products.
An industry-leading portfolio of highly integrated ICs that provide advanced control
functions, offload the CPU, and save space in today’s complex systems. Solutions include
general purpose I/O expansion, temperature sensing, I²C-bus switching, I²C-bus buffering,
LED control, real-time clocks, and more.
(802.11) and Bluetooth
2
C-bus and SPI
®
that support

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